Mobile DRAM Components

Type

Density

Organization

Part Number

Package

Power

Production

 

 

 

 

 

 

 

MSDR

512Mb

32Mx16

K4M51163PI-BG(1)

54-FBGA

1.8V

Now

 

 

 

 

 

16Mx32

K4M51323PI-HG(1)

90-FBGA

1.8V

Now

 

 

 

256Mb

16Mx16

K4X56163PN-FG(1)

60-FBGA

1.8V

Now

 

8Mx32

K4X56323PN-8G(1)

90-FBGA

1.8V

Now

 

 

 

512Mb

32Mx16

K4X51163PI-FG(1)

60-FBGA

1.8V

Now

MDDR

16Mx32

K4X51323PI-8G(1)

90-FBGA

1.8V

Now

 

 

 

 

 

 

 

1Gb

32Mx32

K4X1G323PF-8G(1)

90-FBGA

1.8V

Now

 

 

 

 

 

 

 

 

 

2Gb

64Mx32

K4X2G323PC-8G(1)

90-FBGA

1.8V

Now

 

 

 

 

 

 

 

 

4Gb

x32 (2CS, 2CKE)

K4X4G303PC-AG(1)

168-FBGA, 12x12 PoP, DDP

1.8V

Now

 

 

 

 

 

 

 

x32 (2CS, 2CKE)

K4X4G303PC-7G(1)

240-FBGA, 14x14 PoP, DDP

1.8V

Now

 

 

 

1Gb

1CH x32

K4P1G324EE-AG(1)

168-FBGA, 12x12 PoP

1.2V

Now

 

2Gb

1CH x32

K4P2G324EC-AG(1)

168-FBGA, 12x12 PoP

1.2V

Now

 

2CH x32/ch

K3PE3E300M-XG(1)

216-FBGA, 12x12 PoP

1.2V

Now

 

 

 

 

1CH x32

K4P4G304EC-AG(1)

168-FBGA, 12x12 PoP, DDP, 64Mx32*2

1.2V

Now

 

 

1CH x32

K4P4G154EC-FG(1)

134-FBGA, 11x11.5 PoP, DDP, 128x16*2

1.2V

Now

 

 

 

 

 

 

 

 

4Gb

1CH x32

K4P4G324EB-FG(1)

168-FBGA, 12x12 PoP, MONO, 128Mx32

1.2V

Now

LPDDR2

 

 

 

 

 

 

 

2CH x32/ch

K3PE4E400M-XG(1)

216-FBGA, 12x12 PoP, QDP, 64Mx32*2

1.2V

Now

 

 

 

 

 

 

 

 

 

2CH x32/ch

K3PE4E400A-XG(1)

240-FBGA, 14x14 PoP, QDP, 64Mx32*2

1.2V

Now

 

 

 

 

 

 

 

 

 

1CH x32

K4P8G304EC-FC(1)

134-FBGA, 11x11.5 PoP, QDP, 128x16*4

1.2V

Now

 

8Gb

2CH x32/ch

K3PE8E800M-XG(1)

216-FBGA, 12x12 PoP, QDP, 64Mx32*4

1.2V

Now

 

2CH x32/ch

K3PE7E700M-XG(1)

216-FBGA, 12x12 PoP, DDP, 128Mx32*2

1.2V

Now

 

 

 

 

2CH x32/ch

K3PE7E700A-XG(1)

240-FBGA, 14x14 PoP, DDP, 128Mx32*2

1.2V

Now

 

16Gb

2CH x32/ch

K3PE0E00M-XG(1)

216-FBGA, 12x12 PoP, QDP, 128Mx32*4

1.2V

Now

Notes:

(1) Speed:

 

 

All products offered at Extended, Low, i-TCSR & PASR & DS (Temp, Power)

 

 

Mobile-SDR

Mobile-DDR

LPDDR2

 

 

 

 

60: 166MHz, CL3

D8: 200MHz, CL3

C1: 800Mbps

 

 

 

 

75: 133MHz, CL3

C6: 166MHz, CL3

 

 

 

 

GRAPHICS DRAM COMPONENTS

Type

Density

Organization

Part Number

Package

VDD/VDDQ

Speed Bin (MHz)

 

 

 

 

 

 

 

 

 

 

 

 

K4G20325FC-HC(1)

170-FBGA

1.5/1.5V

2000/2500/3000

 

 

2Gb

64Mx32

K4G20325FC-HC04

170-FBGA

1.35V/1.35V

1800

 

 

 

 

 

 

 

 

 

GDDR5

 

 

K4G20325FC-HC03

170-FBGA

1.35V/1.35V

2000

 

 

 

 

 

 

 

 

 

 

1Gb

32Mx32

K4G10325FE-HC(1)

170-FBGA

1.5/1.5V

2000/2500

 

 

 

 

 

 

 

 

K4G10325FE-HC04

170-FBGA

1.35V/1.35V

1800

 

 

 

 

 

 

 

 

 

 

 

 

 

GDDR3

1Gb

32Mx32

K4J10324KE-HC(1)

136-FBGA

1.8V/1.8V

700/800/1000/1200

 

512Mb

16Mx32

K4J52324KI-HC(1)

136-FBGA

1.8/1.8V

700/800/1000

 

 

 

gDDR3

2Gb

128Mx16

K4W2G1646C-HC(1)

96 FBGA

1.5V/1.5V

800/933/1066

 

1Gb

64Mx16

K4W1G1646G-BC(1)

96 FBGA

1.5V/1.5V

800/933/1066

 

 

 

gDDR2

1Gb

64Mx16

K4N1G164QE-HC(1)

84-FBGA

1.8/1.8V

400/500

 

Notes:

Package

 

 

(1) Speeds (clock cycle - speed bin)

 

 

 

H: FBGA (Halogen Free & Lead Free)

 

03: 0.3ns (3000MHz)

5C: 0.555 (1800MHz)

1A: 1ns (1066MHz gDDR3)

14: 1.429ns (700MHz)

 

B: FBGA (Halogen Free & Lead Free)

 

04: 0.4ns (2500MHz)

08: 0.83ns (1200MHz)

11: 1.1ns (933MHz)

20: 2.0ns (500MHz)

 

 

 

 

05: 0.5ns (2000MHz)

1A: 1ns (1000MHz GDDR3)

12: 1.25ns (800MHz)

25: 2.5ns (400MHz)

DR AM

samsung.com/semi/dram

1H 2011

Mobile & Graphics DRAM Components

9

 

 

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Image 9
Samsung 1H 2011 manual Graphics Dram Components