COMPLETING THE INSTALLATION

Placing the Indoor Unit in Position

ENGLISH

Once you have checked that there are no leaks in the system, you can insulate the piping, hose and cables and place the indoor unit on the installation plate.

1To avoid condensation problems, place heat-resistant polyethylene foam separately around each refrigerant pipe in the lower part of the indoor unit.

2Wrap the refrigerant pipes and the drain hose located at the rear of the indoor unit up in the absorbent pad.

Triply wind the pipes and hose to the end of the indoor unit with the absorbent pad (make intervals of 20mm / 34 inch).

3Wind insulating tape around the pipes, assembly cable and drain hose.

4Place the resulting bundle carefully in the lower part of the indoor unit, making sure that it does not jut out from the rear of the indoor unit.

5Hook the indoor unit on to the installation plate and move the unit to the right and left until you are sure that it is securely in place.

6Finish wrapping vinyl tape around the rest of the piping leading to the outdoor unit.

7Using clamps (optionally supplied), attach the piping to the wall wherever possible.

Installation plate

E-47

Page 47
Image 47
Samsung AM26B1C13, UM18B1C2, UM26B1C2, UM27B1C3, AM27B1C13, AM27B1C07 installation manual Placing the Indoor Unit in Position

AM26B1C13, AM27B1C07, AM27B1C13, UM27B1C3, UM26B1C2 specifications

The Samsung AM27B1C07, UM26B1C2, AM26B1C13, AM27B1C13, and UM18B1C2 are a series of advanced memory devices that underline Samsung's commitment to providing high-performance solutions in the evolving landscape of electronics and computing. These products are characterized by their cutting-edge technologies, reliability, and efficiency, catering to various applications in consumer electronics and industrial use.

One of the main features of these series is their use of Samsung’s state-of-the-art NAND flash technology. This technology is designed to enhance data storage performance while minimizing power consumption, making these devices ideal for portable and battery-operated applications. The devices utilize 3D NAND architecture to increase storage density while ensuring superior durability and speed.

The AM27B1C07 and AM27B1C13 are particularly noted for their high sequential read and write speeds, making them suitable for tasks that require rapid data access, such as gaming and high-definition video processing. These memory solutions support advanced error correction codes (ECC) which ensure data integrity and reliability over time. They have also been optimized for lower latency, enhancing overall system responsiveness.

The UM26B1C2 and UM18B1C2 variants focus on delivering optimized bandwidth, catering well to the demands of modern applications including mobile devices, tablets, and laptops. With integrated power management features, these memory devices help extend battery life while maintaining high-performance levels during peak usage.

All models in this series are built to withstand demanding environments, boasting an extended temperature range that assures stable operation. This feature makes them highly suitable for industrial applications where conditions can fluctuate significantly.

Additionally, Samsung’s commitment to sustainability is evident in these memory solutions. They are designed with energy-efficient processes that not only enhance performance but also reduce the carbon footprint of their production.

Overall, the Samsung AM27B1C07, UM26B1C2, AM26B1C13, AM27B1C13, and UM18B1C2 integrate advanced technologies and features that address the needs of various markets, including consumer electronics, automotive, and industrial sectors. Their blend of high speed, efficiency, and reliability makes them an attractive choice for manufacturers looking to enhance their product offerings with cutting-edge memory solutions.