4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub

Datasheet

Chapter 8 Package Information

8.1Package Outline

 

 

Figure 8.1 USB2601/USB2602 128-Pin TQFP Package Outline

 

 

Table 8.1 USB2601/USB2602 128-Pin TQFP Package Parameters

 

 

 

 

 

 

 

MIN

 

NOMINAL

MAX

REMARKS

 

 

 

 

 

 

A

~

 

~

1.20

Overall Package Height

 

 

 

 

 

 

A1

0.05

 

~

0.15

Standoff

 

 

 

 

 

 

A2

0.95

 

~

1.05

Body Thickness

 

 

 

 

 

 

D

15.80

 

~

16.20

X Span

 

 

 

 

 

 

D1

13.80

 

~

14.20

X body Size

 

 

 

 

 

 

E

15.80

 

~

16.20

Y Span

 

 

 

 

 

 

E1

13.80

 

~

14.20

Y body Size

 

 

 

 

 

 

H

0.09

 

~

0.20

Lead Frame Thickness

 

 

 

 

 

 

L

0.45

 

0.60

0.75

Lead Foot Length

 

 

 

 

 

 

L1

~

 

1.00

~

Lead Length

 

 

 

 

 

 

e

 

 

0.40 Basic

 

Lead Pitch

 

 

 

 

 

 

q

0o

 

~

7o

Lead Foot Angle

W

0.13

 

0.18

0.23

Lead Width

 

 

 

 

 

 

R1

0.08

 

~

~

Lead Shoulder Radius

 

 

 

 

 

 

R2

0.08

 

~

0.20

Lead Foot Radius

 

 

 

 

 

 

ccc

~

 

~

0.08

Coplanarity

 

 

 

 

 

 

Notes:

1.Controlling Unit: millimeter.

2.Tolerance on the true position of the leads is ± 0.035 mm maximum. Package body dimensions D1 and E1 do not include the mold protrusion.

3.Maximum mold protrusion is 0.25 mm.

4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.Details of pin 1 identifier are optional but must be located within the zone indicated.

SMSC USB2601/USB2602

27

Revision 1.6 (06-20-08)

 

DATASHEET