USB 2.0 Flash Drive Controller
Datasheet
Chapter 9 Package Outline
| Figure 9.1 – 100 Pin TQFP Package Outline, 12x12x1.4 Body (Rev A) | |||
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| Table 9.1 – 100 Pin TQFP Package Parameters (Rev A) | ||
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| MIN | NOMINAL | MAX | REMARKS |
A | ~ | ~ | 1.60 | Overall Package Height |
A1 | 0.05 | ~ | 0.15 | Standoff |
A2 | 1.35 | ~ | 1.45 | Body Thickness |
D | 13.80 | ~ | 14.20 | X Span |
D1 | 11.80 | ~ | 12.20 | X body Size |
E | 13.80 | ~ | 14.20 | Y Span |
E1 | 11.80 | ~ | 12.20 | Y body Size |
H | 0.09 | ~ | 0.20 | Lead Frame Thickness |
L | 0.45 | 0.60 | 0.75 | Lead Foot Length |
L1 | ~ | 1.00 | ~ | Lead Length |
e |
| 0.40 Basic |
| Lead Pitch |
θ | 0o | ~ | 7o | Lead Foot Angle |
W | 0.13 | 0.16 | 0.23 | Lead Width |
R1 | 0.08 | ~ | ~ | Lead Shoulder Radius |
R2 | 0.08 | ~ | 0.20 | Lead Foot Radius |
ccc | ~ | ~ | 0.08 | Coplanarity |
Notes:
1Controlling Unit: millimeter.
2Tolerance on the position of the leads is ± 0.035 mm maximum.
3Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
4Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC USB97C242 | Page 20 | Revision 1.4 |
DATASHEET