MDS-JE770

 

 

SECTION 8

 

BD

 

 

 

 

 

 

ELECTRICAL PARTS LIST

NOTE:

 

 

 

 

• Due to standardization, replacements in the

COILS

 

 

parts list may be different from the parts

 

uH: H

 

 

specified in the diagrams or the components

SEMICONDUCTORS

 

used on the set.

 

In each case, u: , for example:

-XX, -X mean standardized parts, so they

 

uA...: A... , uPA... , PA... ,

 

may have some difference from the original

 

uPB... , PB... , uPC... , PC... ,

 

one.

 

uPD..., PD...

• Items marked “*” are not stocked since they

Abbreviation

 

are seldom required for routine service.

 

SP

: Singapore model

 

Some delay should be anticipated when

 

 

 

 

ordering these items.

 

 

 

CAPACITORS:

 

 

 

 

uF: F

 

 

 

RESISTORS

 

 

 

 

All resistors are in ohms.

 

 

 

 

METAL: metal-film resistor

 

 

 

 

METAL OXIDE: Metal Oxide-film resistor

 

 

 

 

F: nonflammable

 

 

 

When indicating parts by reference number, please include the board name.

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Ref. No.

Part No.

Description

 

 

Remarks

Ref. No.

Part No.

Description

 

 

Remarks

 

A-4725-471-A

BD BOARD, COMPLETE

 

 

C160

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

*****************

 

 

C161

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

<CAPACITOR>

 

 

 

C162

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

 

 

 

C163

1-125-891-11

CERAMIC CHIP

0.47uF

10%

10V

C101

1-135-259-11

TANTAL.CHIP

10uF

20%

6.3V

C164

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

 

 

 

 

 

 

C102

1-135-259-11

TANTAL.CHIP

10uF

20%

6.3V

C165

1-162-968-11

CERAMIC CHIP

0.0047uF

10%

50V

C103

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C166

1-125-891-11

CERAMIC CHIP

0.47uF

10%

10V

C104

1-164-227-11

CERAMIC CHIP

0.022uF

10%

25V

C167

1-164-245-11

CERAMIC CHIP

0.015uF

10%

25V

C105

1-115-416-11

CERAMIC CHIP

0.001uF

5%

25V

C169

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C106

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C171

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

C107

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C172

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C108

1-162-969-11

CERAMIC CHIP

0.0068uF

10%

25V

C180

1-117-370-11

CERAMIC CHIP

10uF

 

10V

C109

1-164-677-11

CERAMIC CHIP

0.033uF

10%

16V

C181

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C110

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C182

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C111

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

C183

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

 

C112

1-110-563-11

CERAMIC CHIP

0.068uF

10%

16V

C184

1-117-970-11

ELECT CHIP

22uF

20%

10V

C113

1-162-968-11

CERAMIC CHIP

0.0047uF

10%

50V

C185

1-131-872-11

CERAMIC CHIP

1000PF

10%

630V

C114

1-125-837-11

CERAMIC CHIP

1uF

10%

6.3V

C191

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C115

1-162-966-11

CERAMIC CHIP

0.0022uF

10%

50V

C192

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C116

1-164-227-11

CERAMIC CHIP

0.022uF

10%

25V

C193

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

 

 

 

 

 

 

 

 

C117

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C194

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C118

1-165-176-11

CERAMIC CHIP

0.047uF

10%

16V

C195

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C119

1-165-176-11

CERAMIC CHIP

0.047uF

10%

16V

C196

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C120

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C1401

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

C121

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

<CONNECTOR>

 

 

 

C125

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

 

 

 

 

 

 

 

 

C128

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN101

1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P

 

C131

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

CN102

1-784-835-21 CONNECTOR, FFC (LIF(NON-ZIF)) 27P

 

C132

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN103

1-784-834-21 CONNECTOR, FFC (LIF(NON-ZIF)) 23P

 

C133

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

* CN104

1-580-055-21 PIN, CONNECTOR (SMD) 2P

 

 

 

CN105

1-784-859-21 CONNECTOR, FFC (LIF(NON-ZIF)) 7P

 

C141

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

 

 

 

 

 

 

 

 

C142

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

<DIODE>

 

 

 

C143

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

C144

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

D101

8-719-988-61

DIODE

1SS355TE-17

 

 

C145

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

D181

8-719-080-81

DIODE

FS1J6

 

 

 

 

D183

8-719-080-81

DIODE

FS1J6

 

 

 

C151

1-117-370-11

CERAMIC CHIP

10uF

 

10V

 

 

 

 

 

 

 

 

C152

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

<IC>

 

 

 

 

C153

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

C154

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

IC101

8-752-080-95

IC

CXA2523AR

 

 

 

C155

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC102

8-759-473-51

IC

TLV2361CDBV

 

 

 

 

IC141

8-759-836-79

IC

BH6519FS-E2

 

 

 

C156

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC151

8-752-404-64

IC

CXD2662R

 

 

 

C157

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC153

8-759-671-27

IC

MSM51V4400E-70TS-K

 

 

C158

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

 

 

 

 

 

 

C159

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

IC171

8-759-096-87

IC

TC7WU04FU(TE12R)

 

 

 

 

 

 

 

 

IC181

8-759-481-17

IC

MC74ACT08DTR2

 

 

64

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Image 64
Sony specifications MDS-JE770 Section Electrical Parts List