Sony specifications MDS-JE770 SECTION SERVICE NOTES, Notes On Laser Diode Emission Check

Models: MDS-JE770

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MDS-JE770

MDS-JE770

SECTION 1

SERVICE NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The

CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

Keep the temperature of soldering iron around 270˚C during repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia- tion exposure.

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Sony MDS-JE770 SECTION SERVICE NOTES, Notes On Laser Diode Emission Check, Notes on chip component replacement