Sony MZ-S1 Notes on chip component replacement, Flexible Circuit Board Repairing, Unleaded Solder

MZ-S1

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

On power sources

•Use house current, LR6 (size AA) battery.

•For use in your house: Use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction.

Polarity of the plug

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

•Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to about 350 ˚C .

Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

•Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

•Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

	TABLE OF CONTENTS
1.	SERVICING NOTES	4
2.	GENERAL	6

3.DISASSEMBLY

3-1.	Disassembly Flow	7
3-2.	Case (Lower) Section	8
3-3. Buckle (Upper) Assy, Battery Case Lid		9
3-4.	Case (Upper) Section	10
3-5.	Mechanism Deck (MT-MZN707-177)	10
3-6.	Set Chassis Assy	11
3-7.	MAIN Board	11
3-8.	OP Service Assy (LCX-5R)	12
3-9.	Holder Assy	13
3-10.	DC Motor (Sled) (M602)	13
3-11. DC SSM18B Motor (Spindle) (M601),
	DC Motor (Over Write Head Up/Down) (M603)	14
3-12.	Ornament (R), Switch Unit	14
4.	TEST MODE	15
5.	ELECTRICAL ADJUSTMENTS	20

6.DIAGRAMS

6-1.	Block Diagram – SERVO/USB Section –	32
6-2.	Block Diagram – AUDIO Section –	33
6-3.	Block Diagram – DISPLAY/KEY CONTROL/
	POWER SUPPLY Section –	34
6-4.	Note for Printed Wiring Board and
	Schematic Diagrams	35
6-5.	Printed Wiring Board
	– MAIN Board (Component Side) –	36
6-6.	Printed Wiring Board
	– MAIN Board (Conductor Side) –	37
6-7.	Schematic Diagram – MAIN Board (1/4) –	38
6-8.	Schematic Diagram – MAIN Board (2/4) –	39
6-9.	Schematic Diagram – MAIN Board (3/4) –	40
6-10.	Schematic Diagram – MAIN Board (4/4) –	41
6-11. IC Pin Function Description		48

7.EXPLODED VIEWS

7-1.	Case (Upper) Section	55
7-2.	Chassis Section	56
7-3.	MAIN Board Section	57
7-4.	Case (Lower) Section-1	58
7-5.	Case (Lower) Section-2	59
7-6. Mechanism Deck Section-1 (MT-MZN707-177)		60
7-7. Mechanism Deck Section-2 (MT-MZN707-177)		61
8.	ELECTRICAL PARTS LIST	62

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