Sony Ericsson CDP-XE570 Notes on chip component replacement, Flexible Circuit Board Repairing

Models: CDP-XE570

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CDP-XE570

CDP-XE570

The following caution label is located inside of the unit.

This appliance is classified as a CLASS 1 LASER product.

The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

Keep the temperature of soldering iron around 270˚C during repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

TABLE OF CONTENTS

1.SERVICING NOTE ·························································· 3

2.GENERAL ·········································································· 6

3.DISASSEMBLY

3-1. Loading Panel ····································································· 7

3-2. Base Unit (BU-5BD27) ······················································ 7

4. TEST MODE

4-1. Check Mode ······································································· 8

4-2. AFADJ Mode ····································································· 8

4-3. ADJ Mode ·········································································· 9

5.ELECTRICAL BLOCK CHECKING ························ 10

6.DIAGRAMS

6-1. Circuit Boards Location ··················································· 12

6-2. Schematic Diagram Loading Motor Section ·················· 13

6-3. Printed Wiring Board Loading Motor Section ················ 13

6-4. Printed Wiring Board BD Section ··································· 14

6-5. Schematic Diagram BD Section ······································ 15

6-6. Printed Wiring Board Main Section ································ 16

6-7. Schematic Diagram Main Section ··································· 17

6-8. Printed Wiring Board Display Section ···························· 18

6-9. Schematic Diagram Display Section ······························· 19

6-10. IC Pinfunctions ································································· 20

6-11. IC Block Diagrams ··························································· 21

7. EXPLODED VIEWS

7-1. Front Panel and Case Section ··········································· 23

7-2. CD Mechanism Section (CDM66-5BD27) ······················ 24

7-3. Base Unit Section (BU-5BD27) ······································· 25

8.ELECTRICAL PARTS LIST ······································· 26

MODEL IDENTIFICATION

— BACK PANEL —

Parts No.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

PARTS No.

MODEL

4-232-150-0s

AEP

4-232-150-1s

UK

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Sony Ericsson CDP-XE570 Notes on chip component replacement, Flexible Circuit Board Repairing, Table Of Contents, Diagrams