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The UltraSPARC T2 Processor with CoolThreads Technology

Sun Microsystems, Inc.

Table 2 provides a comparison between the UltraSPARC T2 and the UltraSPARC T1

processor.

Table 2. UltraSPARC T1 and T2 processor features

 

Feature

UltraSPARC T1 Processor

UltraSPARC T2 processor

 

 

 

Cores per processor

Up to 8

Up to 8

Threads per core

4

 

8

Threads per processor

32

64

Hypervisor

Yes

Yes

Memory

4 memory controllers,

4 memory controllers,

 

4

DIMMs per controller

up to 64 FBDIMMs

Caches

16 KB instruction cache,

16 KB instruction cache,

 

8

KB data cache,

8 KB data cache,

 

3

MB L2 cache (4 banks,

4 MB L2 cache (8 banks,

 

12-way associative)

16-way associative)

Technology

9-layer Cu metal, CMOS

65 nm technology

 

process, 90 nm technology

 

Floating point

1

FPU per chip

1 FPU per core,

 

 

 

8 FPUs per chip

Integer resources

Single execution unit

2 integer execution units per

 

 

 

core

Cryptography

Accelerated modular

Stream processing unit per

 

arithmetic operations (RSA)

core, support for the 10 most

 

 

 

popular ciphers

Additional on-chip

Dual 10 Gb Ethernet

resources

 

 

interfaces,

 

 

 

PCI Express interface (x8)

 

 

 

 

Taking Chip Multithreaded Design to the Next Level

When Sun’s in-house design team set out to design the next-generation of CMT processors, they started with key goals in mind:

Increasing computational capabilities to meet the growing demand from Web applications by providing twice the throughput of the UltraSPARC T1 processor

Supporting larger and more diverse workloads with greater floating point performance

Powering faster networking to serve new network-intensive content

Providing end-to-end datacenter encryption

Increasing service levels and reducing downtime

Improving datacenter capacities while reducing costs

CMT architecture is ultimately very flexible, allowing different modular combinations of processors, cores, and integrated components. The considerations listed above drove an internal engineering effort that compared different approaches with regard to making improvements on the successful UltraSPARC T1 architecture. For example,

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Sun Microsystems T5120, T5220 manual Taking Chip Multithreaded Design to the Next Level