4-6 Sun Fire X2250 Server Service Manual • April 2009
4.5 Component Replacement Procedures
The following components are customer-replaceable units (CRUs):
■I/O board (see Section4.5.1, “Replacing the I/O Board” on page 4-7)
■PCIe cards and risers (see Section4.5.2, “Replacing the PCIe Card and Riser
Assembly” on page 4-9)
■Harddisk drives and carriers (see Section 4.5.3, “Replacing aHard Disk Drive and
Carrier” on page 4-13)
■Hard disk drive backplanes (see Section4.5.4, “Replacing an HDD Backplane
Assembly” on page 4-15)
■Optical Disk Drive (DVD or CD) drive (see Section 4.5.5, “Removing and
Installing the ODD Drive Assembly” onpage 4-18)
■Air duct (see Section 4.5.6, “Replacing the Air Duct” onpage 4-20)
■Power supply (see Section 4.5.7, “Replacing the Power Supply” onpage 4-22)
■Single fan module (see Section 4.5.8, “Replacing the Single Fan Module”on
page4-25)
■Dual blower modules (see Section 4.5.9, “Replacing the Dual Blower Module” on
page4-26)
■Memory modules (DIMMs) (see Section 4.5.10, “Replacing Memory Modules” on
page4-28)
■Battery (see Section 4.5.11, “Replacing the System Battery” on page4-33)
■CPU - new installation (see Section 4.5.13, “Installing a New CPU” onpage 4-41).
■Cable kit (see Section 4.5.14, “Replacing Cables” on page 4-45)
The following component should be replaced only by trained field service
technicians:
■CPU - replacement (see Section4.5.12, “Replacing a CPU and Heatsink” on
page4-36).
■Motherboard (see Section4.5.15, “.Motherboard”on page4-46)
6 Power supply 14 HDD 0 backplane
7 Air duct 15 Single fan module
8 HDD 1 backplane 16 System battery (located under
the PCI Expresscard)
TABLE4-1 Sun Fire X2250 Server Internal Components (Continued)
Label Component Label Component