Sun Microsystems, Inc.
Figure 2-5: Dual-Core AMD Opteron Processor Architecture
Note: Sun Fire X4600 servers support 95 W and 120 W 90 nm technology package infrastructure AMD Opteron Rev E and
Rev F processors only.
CPU Packaging
AMD Opteron 800 series processor packaging specifications include:
•940-pin lidded organic micro PGA
•1.27 mm pin pitch
•31 x 31 row pin array
•40 mm x 40 mm organic substrate
•Organic C4 die attachment
•16.5 mm x 11.3 mm die size
AMD Opteron 8000 series processor packaging specifications include:
•1207-pin organic land Grid Array (OLGA)
•1.1 mm pin pitch
•35 x 35 row pin array
•40 mm x 40 mm organic substrate
•Organic C4 die attachment
•16.5 mm x 11.3 mm die size
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