Texas Instruments UCC2891 manual EVM Assembly Drawing and Layout, Top Side Component Assembly

www.ti.com

EVM Assembly Drawing and Layout

8EVM Assembly Drawing and Layout

Figure 14 through Figure 20 show the top-side and bottom-side component placement for the EVM, as well as device pin numbers where necessary. A four layer PCB was designed using the top and bottom layers for signal traces and component placement along with an internal ground plane. The PCB dimensions are 3.6" x 2.7" with a design goal of fitting all components within the industry standard half-brick format, as outlined by the box dimensions 2.28" x 2.20" shown in Figure 15. All components are standard OTS surface mount components placed on the both sides of the PCB. The copper-etch for each layer is also shown.

Figure 14. Top Side Component Assembly

SLUU178A –November 2003 –Revised December 2006 Using the UCC2891 Active Clamp Current Mode PWM Controller 13

Submit Documentation Feedback