Heat Sink

4.Heat Sink (Manhour requirement: 25 min.) 4-1. Remove the bottom case. (See Procedure 1.)

4-2. Remove the DM circuit board. (See Procedure 2.) 4-3. Remove the two (2) screws marked [A-a] from the

soldered face of the DM circuit board and the three

(3)screws marked [A-b] from IC112, IC113 and IC114. The heat sink can then be removed from the DM circuit board. (Fig. 4)

IC114

IC113

IC112

Fig.4

[A-a]

[A-b]

[A-a]

Image 14