Intel Ethernet Switch Boards manual  Mobile Module LPM  Boards & More

Mobile Module (LPM)

Boards & MORE !

Deciding between making or buying?

Reduce outsourcing risks

Minimize potential problems

Stay in control

with Kontron First-Class Outsourcing Management

DIMM-PC

������

������

 Modules & MORE!

So, you are convinced that a Kontron Computer-On-Module

meets your product requirements but you don’t know how

to go about getting a customized baseboard?

We support the full range of

Kontron Computer-On-Modules

 DIMM-PC

 X-board

 E2Brain

 ETX

 ETXexpress

 Boards & MORE!

You are looking for a fully customized computer board?

Custom LPM Application

Mobile Module (LPM)

Designed to be compatible with Intel’s® MMC2 module, the Kontron low power modules for applied computing achieve high performance in embedded applications.

The 500 MHz Intel® Pentium® III processor based module extends the lifecycle of your existing designs.

With the 700 MHz Intel® Pentium® III processor based module, Kontron’s module leverages your design to extend the performance of your system as a low power envelope. In most applications, Kontron’s modules enable customers to improve the performance of their system without redesigning it.

X-

ETX (microSERVER)

ETX baseboard

E2Brain

 We have the right solution for you

Take advantage of our engineering expertise and get your

whole solution from Kontron. We offer design and

production services for your customized baseboard – COM

or full custom solution that are tailored to your needs.

 Specification optimization & consulting for

competitively priced products

 Design and Production to ensure high product quality

 SW & BIOS services to make your solution work

 Lifecycle management to make your investment

pay off

 We offer First-Class Project Management

Our customer focused Outsourcing Project Management

allows you to concentrate on your core business:

 You are in full control of your outsourcing project – our

design process combines flexibility even in the design

Mobile Module (LPM)

Features	LPM500	LPM700	LPM700 /850
CPU	Low power Pentium® III 500 MHz	Low power Pentium® III 700 MHz	Low power Pentium® III 700 MHz
Cache	256 kByte	256 kByte	256 kByte
Chipset	Intel® BX	Intel® BX	Intel® BX
Interface	MMC2-Style (Memory, PCI, AGP)	MMC2-Style (Memory, PCI, AGP)	MMC2-Style (Memory, PCI, AGP)
Dimensions H x W x D	2.5 x 4 x 0.39"	2.5 x 4 x 0.39"	2.5 x 4 x 0.39"
	(63.5 x 101.6 x 9.9 mm)	(63.5 x 101.6 x 9.9 mm)	(63.5 x 101.6 x 9.9 mm)
RoHS compliant			

*) Intel® GX chipset available on request

24

ETXexpress-PM

phase with design quality control through regular

reviews and customer approvals.

 Our support doesn‘t stop with your product approval –

we will support and stay with you throughout the

lifetime of your solution.

RELAX AND BUY! Give us a try!

We`d like to add YOU to our track record of successful outsourcing projects.

25