Intel E8501 manual Packaging Technology, NB Package Dimensions Top View

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2Packaging Technology

The E8500/E8501 chipsets consist of four individual components: the NB, the XMB, the

Intel® 6700PXH 64-bit PCI Hub and the I/O controller hub (ICH5R). The E8500/E8501 chipset NB component use a 42.5 mm squared, 12-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1through Figure 2-3). The E8500/E8501 chipset XMB component uses a 37.5 mm squared, 10-layer FB-BGA package (see Figure 2-4through Figure 2-6). For information on the Intel 6700PXH 64-bit PCI Hub package, refer to the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide. For information on the ICH5 package, refer to the

Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.

Figure 2-1. NB Package Dimensions (Top View)

Handling

 

 

Exclusion

 

 

Area

 

 

 

38.5 mm

 

38.5 mm

TNB

42.5 mm

IHS

 

 

 

42.5 mm

 

Figure 2-2. NB Package Dimensions (Side View)

4.23 ± 0.146 mm

3.79 ± 0.144 mm

IHS

Substrate

2.44 ± 0.071 mm

0.20 See Note 4

0.20 –C–

0.435 ± 0.025 mm

Seating Plane

See Note 1

See Note 3

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

11

Bridge (XMB) Thermal/Mechanical Design Guide

 

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Contents Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Contents Figures Tables Document Revision Description Date Revision HistoryDesign Flow IntroductionThermal Design Process Definition of TermsXMB Reference DocumentsIntroduction Packaging Technology NB Package Dimensions Top ViewNB Package Dimensions Bottom View XMB Package Dimensions Top View Package Mechanical Requirements XMB Package Dimensions Bottom ViewIntel E8500 Chipset NB Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case Temperature SpecificationsIntel E8501 Chipset XMB Thermal Specifications Intel E8501 Chipset NB Thermal SpecificationsIntel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology Die Case Temperature MeasurementsThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Heatsink Performance NB Reference Thermal Solution #1Operating Environment Mechanical Design Envelope First NB Reference Heatsink Volumetric Envelope Board-Level Components Keepout DimensionsFirst NB Heatsink Board Component Keepout First NB Heatsink Thermal Solution AssemblyExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Thermal Solution AssemblySecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Reference Heatsink Volumetric Envelope XMB Heatsink Thermal Solution AssemblyXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Table A-1 NB Heatsink Thermal Solution #1 Thermal Solution Component SuppliersTable A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Table B-1. Mechanical Drawing List Mechanical DrawingsFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Mechanical Drawings

E8501 specifications

The Intel E8501 is a high-performance server processor that belongs to the Intel Itanium 2 family, designed primarily for enterprise-level demands. With its advanced architecture, the E8501 targets mission-critical applications that require reliability, availability, and serviceability (RAS) alongside superior computational power.

One of the key features of the Intel E8501 is its 64-bit architecture, allowing for the handling of larger data sets and improved performance for applications that demand extensive computations. This architecture is built on Intel's Explicitly Parallel Instruction Computing (EPIC) design, which enhances instruction-level parallelism and enables efficient processing of multiple instructions simultaneously, resulting in faster execution of complex tasks.

The E8501 processor is equipped with a maximum clock speed of 1.6 GHz and supports 4MB of L3 cache, significantly improving data retrieval speeds and overall throughput. The chipset accommodates up to 64GB of RAM across four DIMM slots, thus providing ample memory for demanding applications, such as databases and high-performance computing.

Additionally, the E8501 incorporates Intel's Advanced Smart Cache technology, which allows multiple cores to share the cache dynamically. This enhances performance by reducing latency and improving bandwidth for multi-threaded workloads. The processor also employs a dual-core design, which means it can execute multiple threads concurrently, thus maximizing processing efficiency.

Furthermore, the E8501 processor provides support for advanced virtualization technologies, enabling multiple operating systems to run on a single server instance. This capability is essential for data centers managing diverse workloads and consolidating IT resources.

Power efficiency is another significant characteristic of the Intel E8501, featuring enhancements that reduce power consumption while maintaining performance. This is critically important in enterprise environments where energy costs are a substantial concern.

The processor is also equipped with built-in security features, including data encryption capabilities and mechanisms to protect against certain types of cyber threats. These features ensure that sensitive enterprise data remains secure.

In summary, the Intel E8501 stands out as a robust server processor designed to meet the rigorous demands of enterprise-level applications. Its combination of 64-bit architecture, advanced caching mechanisms, virtualization support, and exceptional performance makes it a compelling choice for organizations seeking to enhance their computational capabilities and maintain high levels of reliability. As businesses continue to evolve and require more from their computing environments, the E8501's technologies and features position it as a reliable foundation for mission-critical applications.
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