Intel E8501 manual Extruded Heatsink Profiles

Page 27

NB Reference Thermal Solution #1

6.5.1Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.

Figure 6-4. First NB Heatsink Assembly

6.5.2Extruded Heatsink Profiles

The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.

Figure 6-5shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B.

6.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

6.5.4Thermal Interface Material

A TIM provides improved conductivity between the die and heatsink. The reference thermal solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm (1.5 in. x 1.5 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.

6.5.4.1Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

27

Bridge (XMB) Thermal/Mechanical Design Guide

 

Page 26 Page 28
Image 27
Page 26 Page 28
Contents Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Contents Figures Tables Document Revision Description Date Revision HistoryDesign Flow IntroductionThermal Design Process Definition of TermsXMB Reference DocumentsIntroduction Packaging Technology NB Package Dimensions Top ViewNB Package Dimensions Bottom View XMB Package Dimensions Top View Package Mechanical Requirements XMB Package Dimensions Bottom ViewIntel E8500 Chipset NB Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case Temperature SpecificationsIntel E8501 Chipset NB Thermal Specifications Intel E8500 Chipset XMB Thermal SpecificationsIntel E8501 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology Die Case Temperature MeasurementsThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology NB Reference Thermal Solution #1 Operating EnvironmentHeatsink Performance Mechanical Design Envelope First NB Reference Heatsink Volumetric Envelope Board-Level Components Keepout DimensionsFirst NB Heatsink Board Component Keepout First NB Heatsink Thermal Solution AssemblyExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Thermal Solution AssemblySecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Reference Heatsink Volumetric Envelope XMB Heatsink Thermal Solution AssemblyXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Table A-1 NB Heatsink Thermal Solution #1 Thermal Solution Component SuppliersTable A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Table B-1. Mechanical Drawing List Mechanical DrawingsFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Mechanical Drawings

E8501 specifications

The Intel E8501 is a high-performance server processor that belongs to the Intel Itanium 2 family, designed primarily for enterprise-level demands. With its advanced architecture, the E8501 targets mission-critical applications that require reliability, availability, and serviceability (RAS) alongside superior computational power.

One of the key features of the Intel E8501 is its 64-bit architecture, allowing for the handling of larger data sets and improved performance for applications that demand extensive computations. This architecture is built on Intel's Explicitly Parallel Instruction Computing (EPIC) design, which enhances instruction-level parallelism and enables efficient processing of multiple instructions simultaneously, resulting in faster execution of complex tasks.

The E8501 processor is equipped with a maximum clock speed of 1.6 GHz and supports 4MB of L3 cache, significantly improving data retrieval speeds and overall throughput. The chipset accommodates up to 64GB of RAM across four DIMM slots, thus providing ample memory for demanding applications, such as databases and high-performance computing.

Additionally, the E8501 incorporates Intel's Advanced Smart Cache technology, which allows multiple cores to share the cache dynamically. This enhances performance by reducing latency and improving bandwidth for multi-threaded workloads. The processor also employs a dual-core design, which means it can execute multiple threads concurrently, thus maximizing processing efficiency.

Furthermore, the E8501 processor provides support for advanced virtualization technologies, enabling multiple operating systems to run on a single server instance. This capability is essential for data centers managing diverse workloads and consolidating IT resources.

Power efficiency is another significant characteristic of the Intel E8501, featuring enhancements that reduce power consumption while maintaining performance. This is critically important in enterprise environments where energy costs are a substantial concern.

The processor is also equipped with built-in security features, including data encryption capabilities and mechanisms to protect against certain types of cyber threats. These features ensure that sensitive enterprise data remains secure.

In summary, the Intel E8501 stands out as a robust server processor designed to meet the rigorous demands of enterprise-level applications. Its combination of 64-bit architecture, advanced caching mechanisms, virtualization support, and exceptional performance makes it a compelling choice for organizations seeking to enhance their computational capabilities and maintain high levels of reliability. As businesses continue to evolve and require more from their computing environments, the E8501's technologies and features position it as a reliable foundation for mission-critical applications.
Top Page Image Contents