Intel E8501 manual Contents

Contents

1	Introduction		7
	1.1	Design Flow	7
	1.2	Definition of Terms	8
	1.3	Reference Documents	9

2	Packaging Technology			11
	2.1	Package Mechanical Requirements		14
3	Thermal Specifications			15
	3.1	Thermal Design Power (TDP)		15
	3.2	Die Case Temperature Specifications		15
4	Thermal Simulation			17
5	Thermal Metrology			19
	5.1	Die Case Temperature Measurements		19
	5.2	Power Simulation Software		21
6	NB Reference Thermal Solution #1			23
	6.1	Operating Environment		23
	6.2	Heatsink Performance		23
	6.3	Mechanical Design Envelope		24
	6.4	Board-Level Components Keepout Dimensions		25
	6.5	First NB Heatsink Thermal Solution Assembly		26
		6.5.1	Heatsink Orientation	27
		6.5.2	Extruded Heatsink Profiles	27
		6.5.3	Mechanical Interface Material	27
		6.5.4	Thermal Interface Material	27
		6.5.5	Heatsink Retaining Fastener	28
	6.6	Reliability Guidelines		29
7	NB Reference Thermal Solution #2			31
	7.1	Operating Environment		31
	7.2	Heatsink Performance		31
	7.3	Mechanical Design Envelope		32
	7.4	Board-Level Components Keepout Dimensions		33
	7.5	Second NB Heatsink Thermal Solution Assembly		33
		7.5.1	Heatsink Orientation	34
		7.5.2	Extruded Heatsink Profiles	34
		7.5.3	Mechanical Interface Material	34
		7.5.4	Thermal Interface Material	34
		7.5.5	Heatsink Retaining Fastener	34
	7.6	Reliability Guidelines		35
8	XMB Reference Thermal Solution			37
	8.1	Operating Environment		37
	8.2	Heatsink Performance		37
	8.3	Mechanical Design Envelope		38
	8.4	Board-Level Components Keepout Dimensions		38

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	3
Bridge (XMB) Thermal/Mechanical Design Guide