Intel E8501 Thermal Specifications, Thermal Design Power TDP, Die Case Temperature Specifications

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3Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the E8500/E8501 chipset NB/XMB components to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1for the E8500 chipset NB component, Table 3-2for the E8501 chipset NB component, Table 3-3for the E8500 chipset XMB component and Table 3-4for the E85001 chipset XMB component FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for one or more heatsinks when using the E8500/E8501 chipsets NB/XMB components.

3.2Die Case Temperature Specifications

To ensure proper operation and reliability of the E8500/E8501 chipset NB/XMB components, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1, Table 3-2, Table 3-3and Table 3-4. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® E8500 Chipset NB Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

104°C

 

Tcase_min

5°C

 

TDPwith 1 XMB attached

17.9W

 

TDPwith 2 XMBs attached

19.8W

 

TDPwith 3 XMBs attached

22.4W

 

TDPwith 4 XMBs attached

24.5W

 

NOTE:

1.These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

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Bridge (XMB) Thermal/Mechanical Design Guide

 

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Contents Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Contents Figures Tables Document Revision Description Date Revision HistoryDesign Flow IntroductionThermal Design Process Definition of TermsXMB Reference DocumentsIntroduction Packaging Technology NB Package Dimensions Top ViewNB Package Dimensions Bottom View XMB Package Dimensions Top View Package Mechanical Requirements XMB Package Dimensions Bottom ViewIntel E8500 Chipset NB Thermal Specifications Thermal SpecificationsThermal Design Power TDP Die Case Temperature SpecificationsIntel E8501 Chipset NB Thermal Specifications Intel E8500 Chipset XMB Thermal SpecificationsIntel E8501 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology Die Case Temperature MeasurementsThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology NB Reference Thermal Solution #1 Operating EnvironmentHeatsink Performance Mechanical Design Envelope First NB Reference Heatsink Volumetric Envelope Board-Level Components Keepout DimensionsFirst NB Heatsink Board Component Keepout First NB Heatsink Thermal Solution AssemblyExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Thermal Solution AssemblySecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Reference Heatsink Volumetric Envelope XMB Heatsink Thermal Solution AssemblyXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Table A-1 NB Heatsink Thermal Solution #1 Thermal Solution Component SuppliersTable A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Table B-1. Mechanical Drawing List Mechanical DrawingsFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Mechanical Drawings

E8501 specifications

The Intel E8501 is a high-performance server processor that belongs to the Intel Itanium 2 family, designed primarily for enterprise-level demands. With its advanced architecture, the E8501 targets mission-critical applications that require reliability, availability, and serviceability (RAS) alongside superior computational power.

One of the key features of the Intel E8501 is its 64-bit architecture, allowing for the handling of larger data sets and improved performance for applications that demand extensive computations. This architecture is built on Intel's Explicitly Parallel Instruction Computing (EPIC) design, which enhances instruction-level parallelism and enables efficient processing of multiple instructions simultaneously, resulting in faster execution of complex tasks.

The E8501 processor is equipped with a maximum clock speed of 1.6 GHz and supports 4MB of L3 cache, significantly improving data retrieval speeds and overall throughput. The chipset accommodates up to 64GB of RAM across four DIMM slots, thus providing ample memory for demanding applications, such as databases and high-performance computing.

Additionally, the E8501 incorporates Intel's Advanced Smart Cache technology, which allows multiple cores to share the cache dynamically. This enhances performance by reducing latency and improving bandwidth for multi-threaded workloads. The processor also employs a dual-core design, which means it can execute multiple threads concurrently, thus maximizing processing efficiency.

Furthermore, the E8501 processor provides support for advanced virtualization technologies, enabling multiple operating systems to run on a single server instance. This capability is essential for data centers managing diverse workloads and consolidating IT resources.

Power efficiency is another significant characteristic of the Intel E8501, featuring enhancements that reduce power consumption while maintaining performance. This is critically important in enterprise environments where energy costs are a substantial concern.

The processor is also equipped with built-in security features, including data encryption capabilities and mechanisms to protect against certain types of cyber threats. These features ensure that sensitive enterprise data remains secure.

In summary, the Intel E8501 stands out as a robust server processor designed to meet the rigorous demands of enterprise-level applications. Its combination of 64-bit architecture, advanced caching mechanisms, virtualization support, and exceptional performance makes it a compelling choice for organizations seeking to enhance their computational capabilities and maintain high levels of reliability. As businesses continue to evolve and require more from their computing environments, the E8501's technologies and features position it as a reliable foundation for mission-critical applications.
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