Intel E8501 manual Definition of Terms, Thermal Design Process

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Introduction

Figure 1-1. Thermal Design Process

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1.2Definition of Terms

BGA

Ball grid array. A package type, defined by a resin-fiber substrate, onto which a

 

die is mounted, bonded and encapsulated in molding compound. The primary

 

electrical interface is an array of solder balls attached to the substrate opposite

 

the die and molding compound.

BLT

Bond line thickness. Final settled thickness of the thermal interface material

 

after installation of heatsink.

ICH5

I/O controller hub. The chipset component that contains the primary PCI

 

interface, LPC interface, USB, S-ATA, and other legacy functions.

IHS

Integrated Heat Spreader, Integral part of the NB package. It enhances

 

dissipation of heat generated by the NB die and provides interface surface

 

between NB die and cooling solution.

IMI

Intel® 6700PXH 64-bit PCI Hub

Independent memory Interfaces. Port connecting the NB to the XMB

The chipset component that performs PCI bridging functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.

Tcase_max

Tcase_min

TDP

TIM

NB

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Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

Thermal interface material. Thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance.

Intel® E8500/E8501 chipset North Bridge Component. The chipset component that provides the interconnect to the processors, XMBs and various I/O components.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Bridge XMB Thermal/Mechanical Design Guide Contents Figures Tables Revision History Document Revision Description DateIntroduction Design FlowDefinition of Terms Thermal Design ProcessReference Documents XMBIntroduction NB Package Dimensions Top View Packaging TechnologyNB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Design Power TDPDie Case Temperature Specifications Intel E8500 Chipset NB Thermal SpecificationsIntel E8501 Chipset XMB Thermal Specifications Intel E8501 Chipset NB Thermal SpecificationsIntel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal MetrologyThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Heatsink Performance NB Reference Thermal Solution #1Operating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric EnvelopeFirst NB Heatsink Thermal Solution Assembly First NB Heatsink Board Component KeepoutExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric EnvelopeSecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric EnvelopeXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing ListFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Mechanical Drawings

E8501 specifications

The Intel E8501 is a high-performance server processor that belongs to the Intel Itanium 2 family, designed primarily for enterprise-level demands. With its advanced architecture, the E8501 targets mission-critical applications that require reliability, availability, and serviceability (RAS) alongside superior computational power.

One of the key features of the Intel E8501 is its 64-bit architecture, allowing for the handling of larger data sets and improved performance for applications that demand extensive computations. This architecture is built on Intel's Explicitly Parallel Instruction Computing (EPIC) design, which enhances instruction-level parallelism and enables efficient processing of multiple instructions simultaneously, resulting in faster execution of complex tasks.

The E8501 processor is equipped with a maximum clock speed of 1.6 GHz and supports 4MB of L3 cache, significantly improving data retrieval speeds and overall throughput. The chipset accommodates up to 64GB of RAM across four DIMM slots, thus providing ample memory for demanding applications, such as databases and high-performance computing.

Additionally, the E8501 incorporates Intel's Advanced Smart Cache technology, which allows multiple cores to share the cache dynamically. This enhances performance by reducing latency and improving bandwidth for multi-threaded workloads. The processor also employs a dual-core design, which means it can execute multiple threads concurrently, thus maximizing processing efficiency.

Furthermore, the E8501 processor provides support for advanced virtualization technologies, enabling multiple operating systems to run on a single server instance. This capability is essential for data centers managing diverse workloads and consolidating IT resources.

Power efficiency is another significant characteristic of the Intel E8501, featuring enhancements that reduce power consumption while maintaining performance. This is critically important in enterprise environments where energy costs are a substantial concern.

The processor is also equipped with built-in security features, including data encryption capabilities and mechanisms to protect against certain types of cyber threats. These features ensure that sensitive enterprise data remains secure.

In summary, the Intel E8501 stands out as a robust server processor designed to meet the rigorous demands of enterprise-level applications. Its combination of 64-bit architecture, advanced caching mechanisms, virtualization support, and exceptional performance makes it a compelling choice for organizations seeking to enhance their computational capabilities and maintain high levels of reliability. As businesses continue to evolve and require more from their computing environments, the E8501's technologies and features position it as a reliable foundation for mission-critical applications.