Intel 6700PXH manual Package Mechanical Requirements

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Figure 2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View)

R

AD
AC
AB
AA
	Y
W
	V
	U
	T
	R
4X 0.635	P
	N															31.000 + 0.100
M
	L
	K
	J
	H
4X 15.500	G
	F
	E
23X 1.270	D
	C
	B	+
	A	+
		2	4	6	7	8	10	12	14	16	17	18	20	22	24	A
		1	3	5		9	11	13		15		19	21		23
			23X 1.270
(0.895)				8X	14.605
							29.2100
							31.000 + 0.100									B
							0.200		C	A
NOTES:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The PXH package has an exposed bare die, which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Notes

1.The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/IHS top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.

10 Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines