Intel 6700PXH manual Thermal Specifications, Thermal Design Power TDP, Parameter Value

Page 11

R

3 Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the PXH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1 for the PXH component. Flip chip ball grid array (FC-BGA) packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the PXH component.

3.2Die Case Temperature Specifications

To ensure proper operation and reliability of the PXH component, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1Table 3- 1Table 3-1. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications

Parameter

Value

Notes

Tcase_max

105°C

 

 

Tcase_min

5°C

 

 

TDP Segment A @ 66 MHz and Segment B @ 66 MHz

9.0 watts

TDP Segment A @ 100 MHz and Segment B @ 100 MHz

8.9 watts

 

 

TDP Segment A @ 133 MHz and Segment B @ 133 MHz

8.6 watts

 

 

TDP Segment A @ 66 MHz and Segment B @ 100 MHz

8.9 watts

TDP Segment A @ 66 MHz and Segment B @ 133 MHz

8.8 watts

 

 

TDP Segment A @ 100 MHz and Segment B @ 133 MHz

8.7 watts

Note: These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

11

Page 10 Page 12
Image 11
Page 10 Page 12
Contents Intel 6700PXH 64-bit PCI Hub Page Contents Tables FiguresRevision Description Date Revision HistoryPage Definition of Terms IntroductionIntroduction Reference DocumentsKeepout Exclusion Packaging TechnologyPackage Mechanical Requirements Intel 6700PXH 64-bit PCI Hub Package Dimensions Bottom ViewParameter Value Thermal SpecificationsThermal Design Power TDP Die Case Temperature SpecificationsPage Thermal Simulation Page Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Heatsink Modifications Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout DimensionsTorsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink Orientation Pressure psi Thermal Resistance C × in 2/W Thermal Interface MaterialTest Requirement Pass/Fail Criteria Reliability GuidelinesPart Intel Part Number Supplier Contact Information Thermal Solution Component SuppliersTorsional Clip Heatsink Thermal Solution Page Drawing Description Mechanical DrawingsFigure B-1. Torsional Clip Heatsink Assembly Drawing Figure B-2. Torsional Clip Heatsink Drawing Figure B-3.Torsional Clip Drawing
Top Page Image Contents