R
AThermal Solution Component Suppliers
A.1 Torsional Clip Heatsink Thermal Solution
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Heatsink Assembly includes: |
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| Harry Lin (USA) | ||
• | Unidirectional Fin |
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| Heatsink | CCI/ACK* | hlinack@aol.com | ||
• | Thermal Interface | Monica Chih (Taiwan) | |||
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| Material |
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• | Torsional Clip |
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| monica_chih@ccic.com.tw | |
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| Harry Lin (USA) | |
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Undirectional Fin Heatsink | CCI/ACK | hlinack@aol.com | |||
(31.0 x 31.0 x 12.2 mm) | Monica Chih (Taiwan) | ||||
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| monica_chih@ccic.com.tw | |
Thermal Interface | Chomerics* | Todd Sousa (USA) | |||
(Chomerics* | |||||
| tsousa@parker.com | ||||
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| Harry Lin (USA) | |
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Heatsink Attach Clip | CCI/ACK | hlinack@aol.com | |||
Monica Chih (Taiwan) | |||||
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| monica_chih@ccic.com.tw | |
Foxconn* | Julia Jiang (USA) | ||||
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| juliaj@foxconn.com | ||
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Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.
Intel® 6700PXH | 23 |