Intel 6700PXH manual Thermal Metrology, Die Case Temperature Measurements

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5 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PXH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PXH die temperatures.

5.1Die Case Temperature Measurements

To ensure functionality and reliability, the Tcase of the PXH must be maintained at or between the maximum/minimum operating range of the temperature specification as noted in Table 3-1Table 3- 1Table 3-1. The surface temperature at the geometric center of the die corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, or contact between the thermocouple cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the 0° thermocouple attach approach is recommended.

5.1.1Zero Degree Angle Attach Methodology

1.Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of the heatsink base.

2.Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-1Figure 5-1Figure 5-1).

3.Attach thermal interface material (TIM) to the bottom of the heatsink base.

4.Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.

5.Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, ensure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 5-2Figure 5-2Figure 5-2).

6.Attach heatsink assembly to the PXH and route thermocouple wires out through the milled slot.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Contents Intel 6700PXH 64-bit PCI Hub Page Contents Tables FiguresRevision Description Date Revision HistoryPage Definition of Terms IntroductionIntroduction Reference DocumentsKeepout Exclusion Packaging TechnologyPackage Mechanical Requirements Intel 6700PXH 64-bit PCI Hub Package Dimensions Bottom ViewParameter Value Thermal SpecificationsThermal Design Power TDP Die Case Temperature SpecificationsPage Thermal Simulation Page Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Heatsink Modifications Reference Thermal Solution Operating EnvironmentHeatsink Performance Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyMechanical Design Envelope Torsional Clip Heatsink Board Component Keepout Heatsink Orientation Pressure psi Thermal Resistance C × in 2/W Thermal Interface MaterialTest Requirement Pass/Fail Criteria Reliability GuidelinesThermal Solution Component Suppliers Torsional Clip Heatsink Thermal SolutionPart Intel Part Number Supplier Contact Information Page Drawing Description Mechanical DrawingsFigure B-1. Torsional Clip Heatsink Assembly Drawing Figure B-2. Torsional Clip Heatsink Drawing Figure B-3.Torsional Clip Drawing
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