Intel 6700PXH manual Zero Degree Angle Attach Heatsink Modifications

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Thermal MetrologyThermal MetrologyThermal Metrology

Figure 5-1. Zero Degree Angle Attach Heatsink Modifications

NOTE: Not to scale.

R

Figure 5-2. Zero Degree Angle Attach Methodology (Top View)

Thermocouple Wire

Die

Substrate

Cement +

Thermocouple Bead

001321

NOTE: Not to scale.

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Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Contents Intel 6700PXH 64-bit PCI Hub Page Contents Figures TablesRevision History Revision Description DatePage Introduction Definition of TermsReference Documents IntroductionPackaging Technology Keepout ExclusionIntel 6700PXH 64-bit PCI Hub Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Design Power TDPDie Case Temperature Specifications Parameter ValuePage Thermal Simulation Page Die Case Temperature Measurements Thermal MetrologyZero Degree Angle Attach Heatsink Modifications Operating Environment Reference Thermal SolutionHeatsink Performance Torsional Clip Heatsink Thermal Solution Assembly Board-Level Components Keepout DimensionsMechanical Design Envelope Torsional Clip Heatsink Board Component Keepout Heatsink Orientation Thermal Interface Material Pressure psi Thermal Resistance C × in 2/WReliability Guidelines Test Requirement Pass/Fail CriteriaTorsional Clip Heatsink Thermal Solution Thermal Solution Component SuppliersPart Intel Part Number Supplier Contact Information Page Mechanical Drawings Drawing DescriptionFigure B-1. Torsional Clip Heatsink Assembly Drawing Figure B-2. Torsional Clip Heatsink Drawing Figure B-3.Torsional Clip Drawing