Intel 6700PXH manual Thermal Simulation

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4 Thermal Simulation

Intel provides thermal simulation models of the Intel® 6700PXH 64-bit PCI Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM”* (version 3.1 or higher) by Flomerics, Inc. These models are also available in IcePak* format. Contact your Intel field sales representative to order the Icepak thermal model and user's guide.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Contents Intel 6700PXH 64-bit PCI Hub Page Contents Tables FiguresRevision Description Date Revision HistoryPage Definition of Terms IntroductionIntroduction Reference DocumentsKeepout Exclusion Packaging TechnologyPackage Mechanical Requirements Intel 6700PXH 64-bit PCI Hub Package Dimensions Bottom ViewThermal Design Power TDP Thermal SpecificationsDie Case Temperature Specifications Parameter ValuePage Thermal Simulation Page Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Heatsink Modifications Operating Environment Reference Thermal SolutionHeatsink Performance Torsional Clip Heatsink Thermal Solution Assembly Board-Level Components Keepout DimensionsMechanical Design Envelope Torsional Clip Heatsink Board Component Keepout Heatsink Orientation Pressure psi Thermal Resistance C × in 2/W Thermal Interface MaterialTest Requirement Pass/Fail Criteria Reliability GuidelinesTorsional Clip Heatsink Thermal Solution Thermal Solution Component SuppliersPart Intel Part Number Supplier Contact Information Page Drawing Description Mechanical DrawingsFigure B-1. Torsional Clip Heatsink Assembly Drawing Figure B-2. Torsional Clip Heatsink Drawing Figure B-3.Torsional Clip Drawing