Oki BISM2 manual Fixing Pillars

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10.5.1Fixing Pillars

Ezurio in conjunction with Richco has designed a mounting pillar for use with the Bluetooth Serial Module. This allows the module to be securely held to a primary pcb using snap fit details. A variety of different heights are available to accommodate different variants of Hirose stacked connectors. Pillars supporting a 3.5mm stacked board height can be supplied by Ezurio. These and alternative spacings can also be ordered directly from Richco.

Customer designs using these pillars should use 2.5mm diameter holes on a 1.6mm thick PCB. in conjunction with the 3.6 mm stacked height Hirose if they are to take advantage of this.

Board Spacing	Part number	Source	Matching HRS PCB
			Socket

3.6 mm	NPR2005-153-3.6	Ezurio / Richco	CL537-0032-4-86

4.1 mm	NPR2005-153-4.1	Richco	CL537-0057-5-86

5.1 mm	NPR2005-153-5.1	Richco	CL537-0157-0-86

See http://www.hirose.co.jp/cataloge_hp/e53700036.pdf for detail information on the PCB socket.

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Contents General Description ApplicationsFeatures GpioFunctional Block Diagram Connection DiagramPin Descriptions Electrical Specifications Power SupplyAbsolute Maximum ratings Recommended Operating ParametersSPI Bus UartdtrSpimosi SpimisoPCM Interface General Purpose I/O and ADCMiscellaneous USB DO Characteristics Power ConsumptionTypical Current Consumption in mA AT+BTPDC Characteristics RF PerformanceRange Temperature Performance Data Transfer Rate / DistanceFunctional Description InterfacesUart interface SPI bus Gpio PortPCM Codec Interface 5 ADCIntegrated Firmware GeneralProfiles AT OverviewAT features at a glance GeneralAudio UartOTA Over the Air Configuration Boot modesBluetooth Power ManagementLow Power Modes Low Power Modes using SniffHigh Power Consumption RS232 Modem Signals Application ExamplesModem signalling over Bluetooth Pure Cable Replacement ModeAT&F AT&WAudio Cable voice Modem Control and Status Signals Oscillator OutputApplication Information Antenna PositionPower Supply Considerations Power-On-Reset Power Cycling and Brown Out considerationsRF Shield Mounting the Module onto the application platformFixing Pillars Board to Board Connector Hirose Connector general specificationStacking Height Bluetooth Qualification Process Safety InformationQualification QualificationsSafety and Regulatory Statements Europe EU Declaration of ConformityOperating temperatures Storage temperatureEnvironmental ReliabilityPhysical Dimensions Mechanical DimensionsStandard Module BISM2 Module without antenna special order External AntennaeBISM1 Compatible Module special order Labelling Ordering InformationRelated Documents Differences from previous modulesDisclaimers Data Sheet Status Warranty