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11. Board to Board Connector
This chapter provides specifications for the
11.1Stacking Height
Mating headers from Hirose are available in different stacking heights, allowing the spacing between the BISM2 and carrier pcb to be changed from 3.5mm to 5.0mm.
Item | Part number | Stacking height |
Receptacle on | 3.5 mm – 5 mm | |
Module |
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Headers DF12 series | 3.5 mm | |
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HRS number
4.0 mm
5.0 mm
Notes: The headers listed above are with boss and metal fitting.
Suffix
11.2Hirose Connector general specification
Parameter | Specification (40 pin Board to Board connector) |
Number of Contacts | 40 |
Quantity delivered | 2000 Connectors per Tape & Reel |
Voltage | 50V |
Current Rating | 0.5A max per contact |
Resistance | 0.05 Ohm per contact |
Dielectric Withstanding Voltage | 500V RMS min |
Operating Temperature | |
Contact Material | phosphor bronze (surface: gold plated) |