Oki BISM2 manual Board to Board Connector, Stacking Height, Hirose Connector general specification

Page 25

www.ezurio.com

11. Board to Board Connector

This chapter provides specifications for the 40-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the Module is Hirose type DF12C. Details are available at: http://www.hirose.co.jp/cataloge_hp/e53700036.pdf

11.1Stacking Height

Mating headers from Hirose are available in different stacking heights, allowing the spacing between the BISM2 and carrier pcb to be changed from 3.5mm to 5.0mm.

Item

Part number

Stacking height

Receptacle on

DF12C-40DS-0.5V(86)

3.5 mm – 5 mm

Module

 

 

 

 

 

Headers DF12 series

DF12(3.5)-40DP-0.5V(86)

3.5 mm

 

 

 

HRS number

CL537-0007-7-86

CL537-0032-4-86

DF12(4.0)-40DP-0.5V(86)

4.0 mm

CL537-0057-5-86

DF12(5.0)-40DP-0.5V(86)

5.0 mm

CL537-0157-0-86

Notes: The headers listed above are with boss and metal fitting.

Suffix -86 denotes RoHS compliance.

11.2Hirose Connector general specification

Parameter

Specification (40 pin Board to Board connector)

Number of Contacts

40

Quantity delivered

2000 Connectors per Tape & Reel

Voltage

50V

Current Rating

0.5A max per contact

Resistance

0.05 Ohm per contact

Dielectric Withstanding Voltage

500V RMS min

Operating Temperature

-45°C...+125°C

Contact Material

phosphor bronze (surface: gold plated)

Page 24 Page 26
Image 25
Page 24 Page 26
Contents
Applications General DescriptionGpio FeaturesConnection Diagram Functional Block DiagramPin Descriptions Power Supply Electrical SpecificationsAbsolute Maximum ratings Recommended Operating ParametersUartdtr SPI BusSpimosi SpimisoGeneral Purpose I/O and ADC PCM InterfaceMiscellaneous USB DPower Consumption O CharacteristicsTypical Current Consumption in mA AT+BTPRF Performance DC CharacteristicsRange Data Transfer Rate / Distance Temperature PerformanceInterfaces Functional DescriptionUart interface Gpio Port SPI busPCM Codec Interface 5 ADCGeneral Integrated FirmwareProfiles AT OverviewGeneral AT features at a glanceAudio UartBoot modes OTA Over the Air ConfigurationBluetooth Power ManagementLow Power Modes using Sniff Low Power ModesHigh Power Consumption Application Examples RS232 Modem SignalsPure Cable Replacement Mode Modem signalling over BluetoothAT&F AT&WAudio Cable voice Oscillator Output Modem Control and Status SignalsAntenna Position Application InformationPower-On-Reset Power Cycling and Brown Out considerations Power Supply ConsiderationsRF Shield Mounting the Module onto the application platformFixing Pillars Hirose Connector general specification Board to Board ConnectorStacking Height Safety Information Bluetooth Qualification ProcessQualification QualificationsEurope EU Declaration of Conformity Safety and Regulatory StatementsStorage temperature Operating temperaturesEnvironmental ReliabilityMechanical Dimensions Physical DimensionsStandard Module External Antennae BISM2 Module without antenna special orderBISM1 Compatible Module special order Ordering Information LabellingDifferences from previous modules Related DocumentsDisclaimers Warranty Data Sheet Status
Related manuals
Manual 34 pages 6.14 Kb