IBM MaxLoader manual Otp, Pga, Plcc

MaxLoader User’s Guide

	be erased. The memory’s organization refers to its word width and the
	number of words in the device.
Microcontroller	A device that contains a central processing unit (CPU), memory, and I/O
	ports on a single IC. Microcontrollers that contain any form of nonvolatile
	memory may be programmed on a device programmer. When connected to a
	power supply and external crystal, many of these devices form a complete
	microcomputer.
Non-Volatile	The Characteristic of a memory that does not lose its contents when its
	power is removed. Non-volatile memory is useful in microcomputer circuits
	because it can provide instructions for a CPU as soon as the power is applied,
	before secondary devices, such as disk, can be accessed. Non-Volatile
	memory includes ROM, EPROM and EEPROM.
Oscillator	A device that produces an alternating output current.
OTP	One-time programmable. The characteristic of a memory device that can be
	programmed once but cannot be erased. When an EPROM is described as
	OTP, this means that its die is erasable when exposed to ultraviolet light, but
	because of its package, which is not transparent, it cannot be exposed to light
	and thus it cannot be erased.
Package	The plastic or ceramic that protects an IC die and connects it to the target
	circuit.
PGA	Pin Grid Array. A square, through-hold IC package that has pins located on a
	square grid with 0.1000-inch pitch. It may have up to several hundred pins.
	Used primarily for military and prototype designs.
PLCC	Plastic Leaded Chip Carrier, A square plastic package that has J-shaped leads
	on four sides. This can be surface mounted or placed in a socket for through-
	hole use. Available in 20 to 84 pins.
PLD Compiler	A software package that allows an engineer to specify the functionality of a
	PLD through a high-level language or schematic diagram. The software will
	convert the design into a JEDEC or other file for the PLD programmer. PLD
	compilers are available from numerous IC manufacturers and from third
	parties. The packages from IC manufacturers support only one brand of
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