Table B-1. MSP-TS430PW14 Bill of Materials
Position | Ref Des | No. per | Description | DigiKey Part No. | Comment | |
Board | ||||||
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1 | C1, C2 | 0 | 12pF, SMD0805 |
| DNP | |
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2 | C7 | 1 | 10uF/10V, Tantal Size B |
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3 | C3, C5 | 1 | 100nF, SMD0805 | DNP: C3 | ||
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4 | C8 | 0 | 2.2nF, SMD0805 |
| DNP | |
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5 | D1 | 1 | green LED, SMD0603 |
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| DNP: Headers and receptacles | ||
6 | J1, J2 | 0 | enclosed with kit. Keep vias free of | |||
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| solder: Header: Receptacle | ||
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| J3, J5, J7, |
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| Place jumpers on headers J5, J7, J8, | |
7 | J8, J9, J10, | 8 | ||||
J9, J10, J11, J12; Pos | ||||||
| J11, J12 |
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8 | J4, J6 | 2 | Place jumper on header | |||
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9 |
| 9 | Jumper | Place on: J5, | ||
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10 | JTAG | 1 |
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TH |
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| Micro Crystal |
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12 | Q1 | 0 | Crystal | 32.768kHz, C(Load) = | DNP: keep vias free of solder | |
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| 12.5pF |
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13 | R2, R3 | 2 | 330 Ω, SMD0805 |
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15 | R5 | 1 | 47k Ω, SMD0805 |
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16 | U1 | 1 | Socket: |
| Manuf.: Enplas | |
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17 | PCB | 1 | 56 x 53 mm |
| 2 layers | |
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18 | Adhesive | 4 | about 6mm width, 2mm | e.g., 3M Bumpons Part | Apply to corners at bottom side | |
plastic feet | height | No. | ||||
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19 | MSP430 | 2 | MSP430F2013IPW |
| DNP: enclosed with kit, supplied by TI | |
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36 | Hardware | SLAU278F |
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