
Table B-24.  MSP-TS430PZ100B  Bill of Materials
| Position | Ref Des | No. per | Description | DigiKey Part No. | Comment | |
| Board | ||||||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 1 | C1, C2 | 0 | 12pF, SMD0805 | 
 | DNP | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 
 | C4, C5, C6 | 
 | 
 | 
 | 
 | |
| 2 | , C7, C8, | 6 | 100nF, SMD0805 | 
 | ||
| 
 | C9 | 
 | 
 | 
 | 
 | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 3 | C10, C26 | 2 | 470 nF, SMD0805 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 4 | C11, C12 | 1 | 10 uF / 6.3 V SMD0805 | 
 | C12 DNP | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 
 | C13, C14, | 
 | 
 | 
 | 
 | |
| 5 | C16, C18, | 6 | 4.7 uF SMD0805 | 
 | 
 | |
| 
 | C19, C29 | 
 | 
 | 
 | 
 | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 6 | D1 | 1 | green LED, SMD0805 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 
 | 
 | 
 | 
 | DNP: Headers and receptacles | ||
| 
 | J1, J2, J3, | 
 | 
 | (Header) | ||
| 7 | 0 | enclosed with kit. Keep vias free of | ||||
| J4 | ||||||
| 
 | 
 | 
 | solder: | |||
| 
 | 
 | 
 | 
 | (Receptacle) | ||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 8 | J5 | 1 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 
 | JP3, JP5, | 
 | 
 | 
 | place jumpers on pins  | |
| 
 | JP6, JP7, | 
 | 
 | 
 | ||
| 9 | 7 | JP6, JP7, JP8, JP9, JP10 place | ||||
| JP8, JP9, | ||||||
| 
 | 
 | 
 | 
 | jumpers on pins  | ||
| 
 | JP10 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 10 | JP1, JP2, | 3 | Place jumper on header | |||
| JP4 | ||||||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 11 | JP11, | 3 | 
 | place jumper on header  | ||
| JP12, JP13 | 
 | |||||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 12 | 
 | 13 | Jumper | See Pos. 9 and Pos. 10 and Pos. 11 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 15 | JTAG | 1 | 
 | 
 | ||
| TH | 
 | |||||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 16 | BOOTST | 0 | 
 | "DNP Keep vias free of solder" | ||
| TH | 
 | |||||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 17 | Q1 | 0 | Crystal | 
 | DNP: Q1 Keep vias free of solder | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 21 | R3, R7 | 2 | 330 Ω, SMD0805 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 
 | R1, R2, | 
 | 
 | 
 | 
 | |
| 22 | R4, R6, | 2 | 0 Ohm, SMD0805 | DNP: R4, R6, R8, R10, R11 | ||
| R8, R10, | ||||||
| 
 | 
 | 
 | 
 | 
 | ||
| 
 | R11 | 
 | 
 | 
 | 
 | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 23 | R5 | 1 | 47k Ω, SMD0805 | 
 | ||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 24 | U1 | 1 | Socket:  | 
 | Manuf.: Yamaichi | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 25 | PCB | 1 | 90 x 82 mm | 
 | 2 layers | |
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 26 | Adhesive | 4 | about 6mm width, 2mm | e.g., 3M Bumpons Part | Apply to corners at bottom side | |
| plastic feet | height | No.  | ||||
| 
 | 
 | 
 | ||||
| 
 | 
 | 
 | 
 | 
 | 
 | |
| 27 | MSP430 | 2 | MSP430F6733IPZ | 
 | DNP: enclosed with kit, supplied by TI | |
| 
 | 
 | 
 | 
 | 
 | 
 | 
| 104 | Hardware | SLAU278F  | 
| 
 | 
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