Table B-12. MSP-TS430RHA40A Bill of Materials
Position | Ref Des | No. per | Description | DigiKey Part No. | Comment | |
Board | ||||||
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1 | C1, C2 | 0 | 12pF, SMD0805 |
| DNP: C1, C2 | |
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2 | C5 | 0 | 2.2nF, SMD0805 |
| DNP C12 | |
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3 | C3, C7 | 2 | 10uF/10V, SMD0805 5 |
| DNP C11 | |
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4 | C4, C6 | 2 | 100nF, SMD0805 |
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5 | C9 | 1 | 470nF, SMD0805 |
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6 | D1 | 1 | green LED, SMD0805 |
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| J1, J2, J3, |
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| DNP: headers and receptacles | |
7 | 4 |
| enclosed with kit. Keep vias free of | |||
J4 |
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| solder. : Header : Receptacle | ||
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| DNP: headers and receptacles | |
7.1 |
| 4 |
| enclosed with kit. Keep vias free of | ||
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| solder. : Header : Receptacle | |
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| J5, JP1, |
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8 | JP4, JP5, | 8 | Place jumper on | |||
JP6, JP7, | Place on | |||||
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| JP8, JP9 |
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9 | JP2, JP3 | 2 | place jumper on header | |||
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10 |
| 9 | Jumper | see Pos 8 an 9 | ||
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11 | JTAG | 1 |
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TH |
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12 | BOOTST | 0 |
| DNP. Keep vias free of solder | ||
TH |
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13 | U1 | 1 | Socket: |
| Manuf.: Enplas | |
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| Micro Crystal |
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14 | Q1 | 0 | Crystal | 32.768kHz, C(Load) = | DNP: Q1. Keep vias free of solder | |
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| 12.5pF |
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15 | R1,R7 | 2 | 330R SMD0805 |
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| R2, R3, |
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16 | R5, R6, | 2 | 0 Ohm, SMD0805 | DNP:R2, R3, R5, R6 | ||
| R8, R9, |
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17 | R4 | 1 | 47k SMD0805 |
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18 | PCB | 1 | 79 x 66 mm |
| 2 layers | |
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19 | Rubber | 4 |
| select appropriate; e.g., | apply to corners at bottom side | |
stand off |
| Buerklin: 20H1724 | ||||
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20 | MSP430 | 2 | MSP430N5736IRHA |
| DNP: enclosed with kit. Is supplied by | |
| TI | |||||
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66 | Hardware | SLAU278F |
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