Table B-10. MSP-TS430QFN23x0 Bill of Materials
Pos. | Ref Des | No. per | Description | DigiKey Part No. | Comment | |
Board | ||||||
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1 | C1, C2 | 0 | 12pF, SMD0805 |
| DNP | |
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2 | C3 | 1 | 10uF/10V, Tantal Size B |
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3 | C4 | 1 | 100nF, SMD0805 |
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4 | C5 | 1 | 10nF, SMD0805 |
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5 | D1 | 1 | green LED, SMD0603 |
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| DNP: headers and | |
| J1, J2, J3, |
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| receptacles enclosed with | ||
6 | 0 | kit.Keep vias free of | ||||
| J4 |
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| solder.: Header: | ||
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| Receptacle | |
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7 | J5, JP1 | 2 | Place jumper on header | |||
JP1; Pos | ||||||
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8 | JP2, JP3 | 2 | Place jumper on header | |||
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9 |
| 3 | Jumper | Place on: JP1, JP2, JP3 | ||
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10 | JTAG | 1 |
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11 | BOOTST | 0 |
| DNP: Keep vias free of | ||
| solder | |||||
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| Micro Crystal | DNP: Keep vias free of | |
12 | Q1 | 0 | Crystal | 32.768kHz, C(Load) = | ||
solder | ||||||
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| 12.5pF | ||
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13 | R1 | 1 | 330 Ω, SMD0805 |
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14 | R2, R3 | 0 | 0 Ω, SMD0805 | DNP | ||
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15 | R4 | 1 | 47k Ω, SMD0805 |
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16 | U1 | 1 | Socket: |
| Manuf.: Enplas | |
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17 | PCB | 1 | 79 x 66 mm |
| 2 layers | |
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18 | Adhesive | 4 | ~6mm width, 2mm height | e.g., 3M Bumpons Part No. | Apply to corners at bottom | |
Plastic feet | side | |||||
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19 | MSP430 | 2 | MSP430F2370IRHA |
| DNP: enclosed with kit | |
| supplied by TI | |||||
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60 | Hardware | SLAU278F |
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