Table B-14. MSP-TS430RGZ48B Bill of Materials
Position | Ref Des | No. per | Description | DigiKey Part No. | Comment | |
Board | ||||||
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1 | C1, C2 | 0 | 12pF, SMD0805 |
| DNP | |
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2 | C3, C4 | 0 | 47pF, SMD0805 |
| DNP | |
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3 | C6, C7, | 3 | 10uF/6.3V, SMD0805 |
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C12 |
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4 | C5, C11, | 4 | 100nF, SMD0805 |
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C13, C14 |
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5 | C8 | 1 | 2.2nF, SMD0805 |
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6 | C9 | 1 | 470nF, SMD0805 |
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7 | D1 | 1 | green LED, SMD0805 |
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| DNP: Headers and receptacles | ||
| J1, J2, J3, |
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| (Header) | ||
8 | 0 | enclosed with kit. Keep vias free of | ||||
J4 | ||||||
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| solder: | |||
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| (Receptacle) | ||
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9 | J5 | 1 |
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| JP3, JP5, |
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| place jumpers on pins | |
| JP6, JP7, |
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10 | 7 | JP6, JP7, JP8, JP9, JP10 place | ||||
JP8, JP9, | ||||||
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| jumpers on pins | ||
| JP10 |
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11 | JP1, JP2 | 2 | Place jumper on header | |||
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12 |
| 9 | Jumper | See Pos. 10and Pos. 11 | ||
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13 | JTAG | 1 |
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TH |
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14 | BOOTST | 0 |
| "DNP Keep vias free of solder" | ||
TH |
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| Micro Crystal |
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15 | Q1 | 0 | Crystal | 32.768kHz, C(Load) = | DNP: Q1 Keep vias free of solder | |
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| 12.5pF |
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16 | Q2 | 0 | Crystal | Q2: 4MHz Buerklin: | DNP: Q2 Keep vias free of solder | |
78D134 | ||||||
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| Insulating |
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| http://www.ettinger.de/Ar |
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17 | 0 | Insulating disk to Q2 | t_Detail.cfm?ART_ART |
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disk to Q2 |
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| NUM=70.08.121 |
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18 | R3, R7 | 2 | 330 Ω, SMD0805 |
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| R1, R2, |
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| R4, R6, |
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19 | R8, | 3 | 0 Ohm, SMD0805 | DNP: R6, R8, R9, R10, R11,R12 | ||
| R9,R10, |
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| R11, R12 |
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20 | R5 | 1 | 47k Ω, SMD0805 |
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| Socket: |
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21 | U1 | 1 | QFN11T048- |
| Manuf.: Yamaichi | |
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| 008_A101121_RGZ48 |
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22 | PCB | 1 | 81 x 76 mm |
| 2 layers | |
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23 | Adhesive | 4 | about 6mm width, 2mm | e.g., 3M Bumpons Part | Apply to corners at bottom side | |
plastic feet | height | No. | ||||
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24 | MSP430 | 2 | MSP430F5342IRGZ |
| DNP: enclosed with kit, supplied by TI | |
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72 | Hardware | SLAU278F |
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