Texas Instruments specifications TPS62065/67EVM-347 Assembly Drawings and Layout

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TPS62065/67EVM-347 Assembly Drawings and Layout

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7TPS62065/67EVM-347 Assembly Drawings and Layout

Figure 12 through Figure 16 show the design of the TPS62065/67EVM-347 printed circuit boards. This EVM has been designed using a four-layer, 1-ounce copper-clad PCB (3.81 cm by 4.57 cm) with all components in an active area on the top side of the board. All active traces to the top and bottom layers to allow the user to easily view, probe, and evaluate the TPS62025/67 control ICs in a practical, double-sided application environment. Moving components to both sides of the PCB or using additional internal layers can offer additional size reduction for space-constrained systems.

NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out; they are not intended to be used for manufacturing TPS62065/67EVM-347 PCBs.

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TPS62065/67EVM

SLVU364 –March 2010

 

 

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Contents TPS62065/67EVM Features Electrical Performance SpecificationsTPS62065/67EVM Performance Characteristics IntroductionTPS62056/67EVM Schematic TPS62065EVM SchematicConnector and Test Point Descriptions Enable Jumpers/Switches TPS62065EVMEnable Jumpers/Switches TPS62067EVM Test Configuration Hardware Setup8 JP20 EN 9 J27 Vout SMATesting Procedure TPS62065/67EVM Test Data EfficiencyStart-up TPS62065 TPS62065StartupStart-up and Shutdown TPS62067 TPS62067StartupOutput Voltage Ripple Power-Save Mode TPS62065 Output Voltage Ripple PFM ModeControl Loop Bode Diagrams TPS62065 TPS62065 Gain and Phase vs FrequencyTPS62065/67EVM-347 Assembly Drawings and Layout TPS62065/67EVM Component Placement Top View TPS62065/67EVM Top-Side Copper Top View TPS62065/67EVM Internal Layer 2 X-Ray View, from Top TPS62065/67EVM Internal Layer 1 X-Ray View, from Top TPS62065/67EVM Bottom-Side Copper Bottom View Bill of Materials TPS62065/67EVM Bill of Materials1 2 3Evaluation Board/Kit Important Notice FCC WarningEVM Warnings and Restrictions Important Notice