Texas Instruments MSOP8 Analog Input, Digital Control, Chip Select Shut Down, Digital I/O Buffers

Page 18

Analog Input

5.1 Analog Input

The analog input source can be applied directly to J1 (top or bottom side) or through optional amplifier and signal conditioning modules. The analog input range is dependent on the configuration of the EVM and the ADC installed at location U1. Consult the datasheet for the device to determine the maximum analog input range.

5.2 Digital Control

The digital control signals can be applied directly to J2 (top or bottom side). The modular MSOP8 EVM can also be connected directly to a DSP or a micro controller interface board, such as the HPA449. See the product folder for the EVM or the installed device for a current list of compatible interface and/or accessory boards.

5.3 Chip Select (Shut Down)

Jumper JMP2 is provided to allow the selection of the signals applied to the chip select (/CS) or shutdown (SHDN) pin of the ADC installed on the EVM. The factory default condition for the EVM is to place a shunt jumper between pins 1 - 2 of JMP2. This allows the Frame Sync (FS) signal from DSP host systems to be used as a chip select for the ADC. This signal originates from J2.7. When JMP2 is moved to pins 2- 3, the /CS (SHDN) signal is applied via J2.1.

5.4 Digital I/O Buffers

Single gate buffers U3, U5 and U6 are provided to ensure the safe operation of the modular MSOP8 EVM with low voltage host controllers. The digital I/O voltage applied to these buffers via JMP3 should be set in accordance with the operating voltage of the host controller.

5.5 Default Jumper Locations

Table 5 - 1 provides a list of jumpers found on the EVM and their factory default conditions.

Table 5 - 1. List of Jumpers

Jumper

Shunt Position

Jumper Description

JMP1

Pins 1 - 2

Controls ADC Supply Voltage (default is +5Va Source)

 

 

 

JMP2

Pins 1 - 2

Controls ADC /CS(SHDN) Pin (default is FS from DSP Host)

 

 

 

JMP3

Pins 5 - 6

Controls Digital I/O Voltage (default is +3.3Vd Source)

 

 

 

JMP4

CLOSED

Ties ANALOG and DIGITAL grounds together

 

 

 

JMP5

Pins 1 - 2

Controls External Ref. Source (default is +2.5V from U2)

 

 

 

JMP6

Pins 1 - 2

Controls REFERENCE Source to ADC (default is onboard reference/buffer

 

 

circuit)

5-2

Page 17 Page 19
Image 18
Page 17 Page 19
Contents User’s Guide Important Notice Products ApplicationsEVM Important Notice EVM Warnings and Restrictions Read This First About This ManualEVM Compatible Device Data Sheets Literature Number Application Notes/Additional Literature Literature NumberThird Party Tools Vendor Website Contents TablesPage Features Introduction EVM OverviewFeatures IntroductionPin Number Signal Description Analog InterfaceAnalog Interface Pin Out Page Digital Interface Digital Interface Pin OutPage Signal Pin Number Power SuppliesPower Supply Pin Out ADC Power Stand Alone Operation Reference VoltageADC Power Stand Alone OperationReference Voltage EVM Operation Digital Control Default Jumper LocationsAnalog Input Chip Select Shut DownEVM BOM and Schematic EVM SchematicBill of Materials EVM Schematic Schematic diagram is provided as a referenceTi a

MSOP8 specifications

Texas Instruments MSOP8: An Overview of Features and Technologies

The Texas Instruments MSOP8, or Mini Small Outline Package 8, is a compact, dual-in-line package designed to house various analog and digital ICs. This package format facilitates tighter designs and is particularly suitable for applications where space is a critical constraint. With its compact dimensions of approximately 3.0 mm x 4.0 mm, the MSOP8 is favored in consumer electronics, automotive, and communication devices.

One of the primary features of the MSOP8 package is its low-profile design. The package height is typically around 0.75 mm, making it ideal for applications where height restrictions are paramount. This feature is especially beneficial in portable devices, where engineers must optimize space without sacrificing performance.

The MSOP8 package allows for a high level of integration. Manufacturers can implement multiple functions within a single chip, reducing the need for external components and aiding in overall circuit miniaturization. This characteristic not only streamlines the design process but also enhances reliability by minimizing interconnects and potential failure points.

Thermal performance is another notable aspect of the MSOP8. The construction of the package enables effective heat dissipation. This is crucial in high-performance applications where excessive heat can negatively impact functionality and longevity. Users can expect efficient thermal management from ICs housed in an MSOP8 package.

Texas Instruments has leveraged advanced manufacturing technologies and materials to enhance the reliability and performance of its MSOP8 offerings. Through the use of semiconductor technologies like CMOS (Complementary Metal-Oxide-Semiconductor) and BiCMOS (Bipolar CMOS), these devices deliver lower power consumption, higher speed, and increased functionality.

Electrical characteristics of the MSOP8 package contribute significantly to its versatility. Operating voltage ratings can vary across different devices, but many MSOP8 components are designed to work within a wide voltage range, providing flexibility in design. Input and output current ratings are typically robust, making this package suitable for driving loads in motor control and power management applications.

Furthermore, Texas Instruments ensures that MSOP8 components undergo rigorous testing and qualification processes to meet industry standards. This reliability makes the MSOP8 a preferred choice among engineers and designers working on mission-critical systems.

In conclusion, Texas Instruments' MSOP8 package stands out for its compact design, high level of integration, excellent thermal performance, and strong reliability. With its diverse applications across multiple sectors, the MSOP8 is a cornerstone in modern electronics, enabling innovative designs that meet the challenges of today’s market.
Top Page Image Contents