Texas Instruments MSOP8 manual ADC Power, Stand Alone Operation, Reference Voltage

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ADC Power

4.1 ADC Power

The device installed on the modular MSOP8 EVM has several options in regards to its power source. Refer to the schematic for the following discussion.

JMP1 and JMP3 allow the user to select the power supply used by the ADC. When JMP1 is in the default factory position (Shunt on pins 1- 2), power to the ADC comes from J3.3 or TP5. Single gate digital buffers (U3, U5, and U6) are installed on the ADC’s digital input/output lines to allow operation with low voltage controllers, such as the MSP430. The supply voltage to these buffers is determined by JMP3 or the voltage applied to TP7.

4.2 Stand Alone Operation

When used as a stand alone EVM, the analog power can be applied to TP5, referenced to TP6. Digital power can be applied to TP7 referenced to TP4. While filters are provided for all power supply inputs, optimal performance of the EVM requires a clean, well-regulated power source.

Caution

The ADC’s that are compatible with this EVM have a variety of power supply requirements. Check the appropriate data sheets and verify all power supplies are within the safe operating limits of the ADC before applying power to the EVM.

4.3 Reference Voltage

The modular MSOP8 can be configured to use the onboard reference/buffer circuits (U2 and U4) or an external reference applied to J1.20. Jumpers JMP5 and JMP6 control the reference source. In the factory default position (shunt on JMP5 pins 1- 2), a 2.5 V reference is supplied by U2. Moving the shunt at JMP5 to positions 2 - 3 allows an external reference applied to J1.20 to be used.

Caution

The ADC’s that are compatible with this EVM have a variety of reference requirements. Check the appropriate data sheets and verify external reference sources are within the safe operating limits of the ADC before applying power to the EVM.

JMP6 controls the actual application of the reference source to the ADC. Note that JMP6 is not installed on EVM boards for ADS7818, ADS7834, and ADS7835 devices. In the factory default position (shunt on pins 1 - 2), the reference source is the on board reference/buffer circuit. Moving the shunt on JMP6 to pins 2 - 3 allows the voltage applied to the ADC (+Vadc) to be used as the reference source.

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Contents User’s Guide Important Notice Products ApplicationsEVM Important Notice EVM Warnings and Restrictions Read This First About This ManualApplication Notes/Additional Literature Literature Number EVM Compatible Device Data Sheets Literature NumberThird Party Tools Vendor Website Contents TablesPage Features Introduction EVM OverviewFeatures IntroductionAnalog Interface Pin Number Signal DescriptionAnalog Interface Pin Out Page Digital Interface Digital Interface Pin OutPage Power Supplies Power Supply Pin OutSignal Pin Number ADC Power Stand Alone Operation Reference VoltageStand Alone Operation ADC PowerReference Voltage EVM Operation Default Jumper Locations Analog InputDigital Control Chip Select Shut DownEVM Schematic EVM BOM and SchematicBill of Materials EVM Schematic Schematic diagram is provided as a referenceTi a

MSOP8 specifications

Texas Instruments MSOP8: An Overview of Features and Technologies

The Texas Instruments MSOP8, or Mini Small Outline Package 8, is a compact, dual-in-line package designed to house various analog and digital ICs. This package format facilitates tighter designs and is particularly suitable for applications where space is a critical constraint. With its compact dimensions of approximately 3.0 mm x 4.0 mm, the MSOP8 is favored in consumer electronics, automotive, and communication devices.

One of the primary features of the MSOP8 package is its low-profile design. The package height is typically around 0.75 mm, making it ideal for applications where height restrictions are paramount. This feature is especially beneficial in portable devices, where engineers must optimize space without sacrificing performance.

The MSOP8 package allows for a high level of integration. Manufacturers can implement multiple functions within a single chip, reducing the need for external components and aiding in overall circuit miniaturization. This characteristic not only streamlines the design process but also enhances reliability by minimizing interconnects and potential failure points.

Thermal performance is another notable aspect of the MSOP8. The construction of the package enables effective heat dissipation. This is crucial in high-performance applications where excessive heat can negatively impact functionality and longevity. Users can expect efficient thermal management from ICs housed in an MSOP8 package.

Texas Instruments has leveraged advanced manufacturing technologies and materials to enhance the reliability and performance of its MSOP8 offerings. Through the use of semiconductor technologies like CMOS (Complementary Metal-Oxide-Semiconductor) and BiCMOS (Bipolar CMOS), these devices deliver lower power consumption, higher speed, and increased functionality.

Electrical characteristics of the MSOP8 package contribute significantly to its versatility. Operating voltage ratings can vary across different devices, but many MSOP8 components are designed to work within a wide voltage range, providing flexibility in design. Input and output current ratings are typically robust, making this package suitable for driving loads in motor control and power management applications.

Furthermore, Texas Instruments ensures that MSOP8 components undergo rigorous testing and qualification processes to meet industry standards. This reliability makes the MSOP8 a preferred choice among engineers and designers working on mission-critical systems.

In conclusion, Texas Instruments' MSOP8 package stands out for its compact design, high level of integration, excellent thermal performance, and strong reliability. With its diverse applications across multiple sectors, the MSOP8 is a cornerstone in modern electronics, enabling innovative designs that meet the challenges of today’s market.
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