Silicon Laboratories SI4734/35-B20 PCB Land Pattern Dimensions, Symbol Millimeters Min Max, Bsc

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Si4734/35-B20

Table 17. PCB Land Pattern Dimensions

Symbol

Millimeters

 

 

 

 

Min

Max

 

 

 

D

2.71

REF

 

 

 

D2

1.60

1.80

 

 

 

e

0.50

BSC

 

 

E

2.71 REF

 

 

 

E2

1.60

1.80

 

 

 

f

2.53

BSC

 

 

 

GD

2.10

 

 

 

Symbol

Millimeters

 

 

 

 

Min

Max

 

 

 

GE

2.10

 

 

 

W

0.34

 

 

 

X

0.28

 

 

 

Y

0.61

REF

 

 

 

ZE

3.31

 

 

 

ZD

3.31

 

 

 

Notes: General

1.All dimensions shown are in millimeters (mm) unless otherwise noted.

2.Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3.This Land Pattern Design is based on IPC-SM-782 guidelines.

4.All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.

Notes: Solder Mask Design

1.All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.

Notes: Stencil Design

1.A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

2.The stencil thickness should be 0.125mm (5 mils).

3.The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.

4.A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides approximately 70% solder paste coverage on the pad, which is optimum to assure correct component stand-off.

Notes: Card Assembly

1.A No-Clean, Type-3 solder paste is recommended.

2.The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.

Rev. 1.0

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Contents Description FeaturesFunctional Block Diagram ApplicationsSi4734/35-B20 Table of Contents Recommended Operating Conditions Electrical SpecificationsParameter Symbol Test Condition Min Typ Max Unit Parameter Symbol Value UnitSupplies and Interface DC CharacteristicsParameter Symbol Test Condition Min Typ Max Unit FM Mode AM/SW/LW ModeGPO1, GPO2/INT Parameter Symbol Min Typ Max UnitRST Start Wire Control Interface Characteristics1,2,3Sclk Sdio Sclk SENSPI Control Interface Write Timing Parameters Dclk DFS Dout Fmdeemphasis = FM Receiver Characteristics1,2RDS Bler 5% Si4734/35-B20 KHz Long Wave LW 153 279 Crystal Oscillator RefclkprescaleRefclk Si4734/35-GM Typical Application SchematicOptional Components Bill of MaterialsComponents Value/Description Supplier 3.6V Functional DescriptionOverview 5.5SW Receiver Operating ModesFM Receiver AM ReceiverAudio Sample Rates Digital Audio Interface Si4735 OnlyAudio Data Formats I2S Digital Audio Format RDS/RBDS Processor Si4735 Only Stereo Audio Processing De-emphasisStereo DAC Soft MuteReference Clock TuningBus Mode Select on Rising Edge SeekSPI Control Interface Mode GPO Outputs Firmware UpgradesReset, Power Up, and Power Down Programming with CommandsDescription Commands and PropertiesSi473x Command Summary CmdSi473x Property Summary Prop Name Description DefaultAmchannelfilter RdsconfigRxvolume AmdeemphasisPin Numbers Name Description Pin Descriptions Si4734/35-GMRDS/RBDS Ordering GuidePart Number Description Package Operating QFNTop Mark Explanation Package Markings Top MarksSi4734/35 Top Mark Package Outline Si4734/35 QFN Symbol Millimeters Min Nom MaxPCB Land Pattern PCB Land Pattern Si4734/35 QFNBSC PCB Land Pattern DimensionsSymbol Millimeters Min Max Additional Reference Resources Revision 0.4 to Revision Document Change ListContact Information

SI4734/35-B20 specifications

Silicon Laboratories SI4734/35-B20 is an advanced, highly integrated broadcast radio receiver designed for various consumer applications. Hailed for its compactness and versatility, the SI4734/35-B20 offers extensive features that enable radio reception across multiple frequency bands, including AM, FM, and shortwave. It caters to the needs of manufacturers looking to incorporate reliable radio capabilities into their devices, ensuring quality sound and performance without the cumbersome designs typically associated with traditional radio receivers.

At the heart of the SI4734/35-B20 are performance-optimized technologies. One standout feature is the device's ability to support digital and analog processing simultaneously, utilizing Silicon Labs’ proprietary digital signal processing (DSP) technology. This architecture not only enhances signal clarity but also helps in mitigating noise, enabling users to experience a superior audio quality across varied environments.

Another notable characteristic of the SI4734/35-B20 is its low power consumption, making it ideal for battery-operated devices. The receiver employs sophisticated power management techniques that allow it to operate efficiently, prolonging battery life while maintaining optimal performance. In this context, the “sleep” mode and fast wake-up times contribute to significant energy savings, affirming its suitability for portable applications.

The SI4734/35-B20 is designed with a robust set of features for ease of integration into various systems. The device supports multiple programmable interfaces, including I2C, providing flexibility in communication with microcontrollers and facilitating straightforward integration into existing designs. Because of its programmable architecture, developers can customize the receiver’s capabilities according to the specific needs of their applications.

Additional features include automatic frequency control (AFC) for stability in tuning, allowing seamless transitions while listening to programs. The built-in AGC (automatic gain control) optimizes the receiver's sensitivity to ensure clear reception even in weak signal conditions.

The SI4734/35-B20 also possesses a wide frequency range, accommodating both standard and niche applications. Its compact form factor and surface-mount technology (SMT) footprint further enhance its appeal to developers seeking to maximize board space in their designs.

In conclusion, the Silicon Laboratories SI4734/35-B20 is a significant advancement in radio receiver technology, combining advanced DSP, low power consumption, and ease of integration. These attributes make it a preferred choice for engineers and manufacturers looking to deliver high-quality audio experiences across a range of consumer electronics, from radios to multifunctional smart devices.