Seagate ST9320328CS, ST9500323CS manual Corrosive environment

Page 25

2.15.1European Union Restriction of Hazardous Substances (RoHS)

The European Union Restriction of Hazardous Substances (RoHS) Directive, restricts the presence of chemical substances, including Lead, Cadmium, Mercury, Hexavalent Chromium, PBB and PBDE, in electronic products, effective July 2006. This drive is manufactured with components and materials that comply with the RoHS Direc- tive.

2.15.2China Restriction of Hazardous Substances (RoHS) Directive

This product has an Environmental Protection Use Period (EPUP) of 20 years. The following table contains information mandated by China's "Marking Requirements for Control of Pollution Caused by Electronic Information Products" Standard.

"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower than the threshold defined by the China RoHS MCV Standard.

"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over the threshold defined by the China RoHS MCV Standard.

2.16Corrosive environment

Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845. However, this accelerated testing cannot duplicate every potential application environment.

Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals as electronic drive component reliability can be affected by the installation environment. The silver, cop- per, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any electronic equip- ment may be extended by replacing materials near circuitry with sulfide-free alternatives.

Pipeline HD Mini Series SATA Product Manual, Rev. E

15

Page 24 Page 26
Image 25
Page 24 Page 26
Contents ST9500323CSST9250311CS ST9320328CSST91603110CS Pipeline HD Mini Series SataRevision Date Sheets affected or comments Revision historyPipeline HD Mini Series Sata Product Manual, Rev. E Pipeline HD Mini Series Sata Product Manual, Rev. E Contents Pipeline HD Mini Series Sata Product Manual, Rev. E List of Figures Page Seagate Technology Support Services Viii About the Serial ATA interface IntroductionPage Specification summary table Drive specificationsSleep mode LBA mode Default logical geometryFormatted capacity Cylinders Read/write heads Sectors per track 16,383Physical organization Physical characteristicsRecording and interface technology Seek timeStart/stop times Power specificationsTypical current profile DC powerPower management modes Power-management modesActive mode Idle modeEnvironmental specifications Acoustics Test for Prominent Discrete Tones PDTs Electromagnetic immunityRadio frequency environments Performance Reference Test Description Level StandardReliability Safety certificationAgency certification Annualized Failure Rate AFRKorean RRL Environmental protectionAustralian C-Tick N176 FCC verificationEuropean Union Restriction of Hazardous Substances RoHS Corrosive environmentChina Restriction of Hazardous Substances RoHS Directive Pipeline HD Mini Series Sata Product Manual, Rev. E Handling and static-discharge precautions Configuring and mounting the driveConfiguring the drive Serial ATA cables and connectorsTop cover stiffness/deflection Drive mountingMeasurements shown in are in inches Pipeline HD Mini Series Sata Product Manual, Rev. E Signal Serial ATA connector pin definitionsSerial ATA Sata interface Segment Pin Function DefinitionPower Supported ATA commandsCommand name Command code in hex ATA-standard commands Command name Command code in hex ATA-standard security commands ATA-standard power-management commandsWord Description Value Identify Device commandXxxxH Bit Word Description if bit is set to Bit WordSet Features command values Set Features commandA.R.T. commands 3 S.M.A.R.T. commandsCode in features register A.R.T. command Pipeline HD Mini Series Sata Product Manual, Rev. E Index ITE TPI Pipeline HD Mini Series Sata Product Manual, Rev. E Page Seagate Technology LLC
Top Page Image Contents