Cypress nvSRAM, CY14B102L manual Device Operation, Sram Read, Sram Write, AutoStore Operation

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PRELIMINARY

CY14B102L, CY14B102N

Device Operation

The CY14B102L/CY14B102N nvSRAM is made up of two functional components paired in the same physical cell. They are an SRAM memory cell and a nonvolatile QuantumTrap cell. The SRAM memory cell operates as a standard fast static RAM. Data in the SRAM is transferred to the nonvolatile cell (the STORE operation), or from the nonvolatile cell to the SRAM (the RECALL operation). Using this unique architecture, all cells are stored and recalled in parallel. During the STORE and RECALL operations, SRAM read and write operations are inhibited. The CY14B102L/CY14B102N supports infinite reads and writes similar to a typical SRAM. In addition, it provides infinite RECALL operations from the nonvolatile cells and up to 200K STORE operations. See the “Truth Table For SRAM Operations” on page 15 for a complete description of read and write modes.

SRAM Read

The CY14B102L/CY14B102N performs a read cycle when CE and OE are LOW and WE and HSB are HIGH. The address specified on pins A0-17or A0-16determines which of the 262,144 data bytes or 131,072 words of 16 bits each are accessed. Byte enables (BHE, BLE) determine which bytes are enabled to the output, in the case of 16-bit words. When the read is initiated by an address transition, the outputs are valid after a delay of tAA (read cycle 1). If the read is initiated by CE or OE, the outputs are valid at tACE or at tDOE, whichever is later (read cycle 2). The data output repeatedly responds to address changes within the tAA access time without the need for transitions on any control input pins. This remains valid until another address change or until CE or OE is brought HIGH, or WE or HSB is brought LOW.

SRAM Write

A write cycle is performed when CE and WE are LOW and HSB is HIGH. The address inputs must be stable before entering the write cycle and must remain stable until CE or WE goes HIGH at the end of the cycle. The data on the common IO pins DQ0–15are written into the memory if the data is valid tSD before the end of a WE controlled write or before the end of an CE controlled write. The Byte Enable inputs (BHE, BLE) determine which bytes are written, in the case of 16-bit words. It is recommended that OE be kept HIGH during the entire write cycle to avoid data bus contention on common IO lines. If OE is left LOW, internal circuitry turns off the output buffers tHZWE after WE goes LOW.

AutoStore Operation

The CY14B102L/CY14B102N stores data to the nvSRAM using one of the following three storage operations: Hardware Store activated by HSB; Software Store activated by an address sequence; AutoStore on device power down. The AutoStore operation is a unique feature of QuantumTrap technology and is enabled by default on the CY14B102L/CY14B102N.

During a normal operation, the device draws current from VCC to charge a capacitor connected to the VCAP pin. This stored charge is used by the chip to perform a single STORE operation. If the voltage on the VCC pin drops below VSWITCH, the part automatically disconnects the VCAP pin from VCC. A STORE operation is initiated with power provided by the VCAP capacitor.

Figure 4 shows the proper connection of the storage capacitor (VCAP) for automatic store operation. Refer to DC Electrical Characteristics on page 7 for the size of VCAP. The voltage on the VCAP pin is driven to VCC by a regulator on the chip. A pull up should be placed on WE to hold it inactive during power up. This pull up is only effective if the WE signal is tri-state during power up. Many MPUs tri-state their controls on power up. This should be verified when using the pull up. When the nvSRAM comes out of power-on-recall, the MPU must be active or the WE held inactive until the MPU comes out of reset.

To reduce unnecessary nonvolatile stores, AutoStore and hardware store operations are ignored unless at least one write operation has taken place since the most recent STORE or RECALL cycle. Software initiated STORE cycles are performed regardless of whether a write operation has taken place. The HSB signal is monitored by the system to detect if an AutoStore cycle is in progress.

Figure 4. AutoStore Mode

 

Vcc

10kOhm

0.1uF

Vcc

 

WE

VCAP

 

VCAP

 

VSS

Hardware STORE Operation

The CY14B102L/CY14B102N provides the HSB[7] pin to control and acknowledge the STORE operations. Use the HSB pin to request a hardware STORE cycle. When the HSB pin is driven LOW, the CY14B102L/CY14B102N conditionally initiates a STORE operation after tDELAY. An actual STORE cycle only begins if a write to the SRAM has taken place since the last STORE or RECALL cycle. The HSB pin also acts as an open drain driver that is internally driven LOW to indicate a busy condition when the STORE (initiated by any means) is in progress.

SRAM read and write operations that are in progress when HSB is driven LOW by any means are given time to complete before the STORE operation is initiated. After HSB goes LOW, the CY14B102L/CY14B102N continues SRAM operations for tDELAY. If a write is in progress when HSB is pulled LOW it is enabled a time, tDELAY to complete. However, any SRAM write cycles requested after HSB goes LOW are inhibited until HSB returns HIGH. In case the write latch is not set, HSB will not be driven LOW by the CY14B102L/CY14B102N but any SRAM read and write cycles are inhibited until HSB is returned HIGH by MPU or other external source.

During any STORE operation, regardless of how it is initiated, the CY14B102L/CY14B102N continues to drive the HSB pin LOW, releasing it only when the STORE is complete. Upon

Document #: 001-45754 Rev. *B

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Contents Features Logic Block Diagram1, 2Functional Description Cypress Semiconductor CorporationTop View PinoutsNot to scale Pin Definitions Device Operation Sram ReadSram Write AutoStore OperationHardware Recall Power Up Mode SelectionA15 A08 Mode Power Software StoreMode Selection A15 A08 Power Preventing AutoStoreData Protection Noise ConsiderationsMaximum Ratings DC Electrical CharacteristicsOperating Range Data Retention and Endurance CapacitanceThermal Resistance AC Test ConditionsAC Switching Characteristics Switching WaveformsMin Max Sram Read Cycle+LJK,PSHGDQFH $GGUHVV $GGUHVV9DOLG6WDQGE\ $FWLYH Sram Write Cycle #2 CE Controlled3, 18, 19 Parameters Description 20 ns 25 ns 45 ns Unit Min Max AutoStore/Power Up RecallHSB Software Controlled STORE/RECALL Cycle To Output Active Time when write latch not set Hardware Store CycleDescription 20 ns 25 ns 45 ns Unit Min Max Hardware Store Pulse WidthTruth Table For Sram Operations Inputs/Outputs2 Mode PowerHigh Z Ordering Information CY14B102L-ZS25XCT CY14B102L-ZS25XITCY14B102L-ZS25XAT CY14B102N-BA25XCTCY14B102L-ZS45XCT CY14B102L-ZS45XITCY14B102L-ZS45XAT CY14B102L-BA45XCTPart Numbering Nomenclature CY 14 B 102 L ZS P 20 X C TZS Tsop NvsramPackage Diagrams TOP ViewBall Fbga 6 mm x 10 mm x 1.2 mm 51-85160 Document History GvchGVCH/AESA GVCH/PYRSSales, Solutions, and Legal Information USB

CY14B102L, nvSRAM specifications

Cypress nvSRAM CY14B102L is a sophisticated memory solution designed to bridge the gap between volatile and non-volatile memory technologies. This device offers a unique blend of SRAM speed with the non-volatility of Flash memory, making it an ideal choice for applications that require data retention without the need for continuous power.

One of the standout features of the CY14B102L is its ability to retain data for over 20 years without power, thanks to its innovative non-volatile SRAM technology. This means that critical information can be stored safely during power outages or system failures, ensuring data integrity in mission-critical applications. The device uses a reliable, self-timed write process, which simplifies the write operation and enhances system efficiency by eliminating the need for complex write management processes.

With a capacity of 1 megabit (128 K x 8), the CY14B102L offers ample storage for a wide variety of applications. Its fast access times, typically around 45 ns, make it suitable for high-speed operations typically associated with SRAMs. This rapid access is paramount for real-time applications where delays can lead to critical failures or data corruption.

The CY14B102L utilizes a CMOS process technology that not only contributes to its low power consumption but also ensures high reliability and durability. Operating in the wide temperature range of -40°C to +125°C, this nvSRAM is well-suited for automotive, industrial, and telecommunications applications.

In terms of connectivity, the CY14B102L supports a standard SRAM interface, simplifying integration into existing systems. Additionally, its ease of use is further enhanced by being available in a variety of package options, allowing designers to select the best fit for their needs without compromising on performance.

In conclusion, the Cypress nvSRAM CY14B102L is a powerful memory device that combines the speed of SRAM with non-volatile storage capabilities. With its extended data retention, fast access times, efficient write processes, and robust design, it is an excellent choice for applications that demand both speed and reliability, making it an invaluable asset for engineers looking to optimize system performance while maintaining data integrity.