Cypress CY7C1333H manual Name Description, Byte Write Inputs, active LOW . Qualified with

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PRELIMINARY

CY7C1333H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Definitions (100-pin TQFP Package)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Name

I/O

 

Description

 

 

 

 

 

 

A0, A1, A

Input-

Address Inputs used to select one of the 64K address locations. Sampled at the rising edge

 

 

 

 

 

 

 

 

 

Synchronous

of the CLK. A[1:0] are fed to the two-bit burst counter.

 

 

 

 

 

 

BW

[A:D]

Input-

Byte Write Inputs, active LOW. Qualified with

WE

to conduct Writes to the SRAM. Sampled on

 

 

 

 

 

 

 

 

 

Synchronous

the rising edge of CLK.

 

 

 

 

 

 

WE

 

 

 

 

Input-

Write Enable Input, active LOW. Sampled on the rising edge of CLK if

CEN

is active LOW. This

 

 

 

 

 

 

 

 

 

Synchronous

signal must be asserted LOW to initiate a Write sequence.

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Advance/Load Input. Used to advance the on-chip address counter or load a new address. When

 

 

ADV/LD

 

 

 

 

 

 

 

 

 

 

Synchronous

HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new

 

 

 

 

 

 

 

 

 

 

address can be loaded into the device for an access. After being deselected, ADV/LD should be

 

 

 

 

 

 

 

 

 

 

driven LOW in order to load a new address.

 

 

 

 

 

 

CLK

Input-Clock

Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with

CEN.

CLK

 

 

 

 

 

 

 

 

 

 

is only recognized if CEN is active LOW.

 

 

 

 

 

 

 

1

 

Input-

Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with

 

 

CE

 

 

 

 

 

 

 

 

 

Synchronous

CE2, and CE3 to select/deselect the device.

 

 

 

 

 

 

CE2

Input-

Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with

 

 

 

 

 

 

 

 

 

Synchronous

CE1 and CE3 to select/deselect the device.

 

 

 

 

 

 

 

3

 

Input-

Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with

 

 

CE

 

 

 

 

 

 

 

 

 

Synchronous

CE1 and CE2 to select/deselect the device.

 

 

 

 

 

 

 

 

 

 

Input-

Output Enable, asynchronous input, active LOW. Combined with the synchronous logic block

 

 

OE

 

 

 

 

 

 

 

 

 

Asynchronous

inside the device to control the direction of the I/O pins. When LOW, the I/O pins are allowed to

 

 

 

 

 

 

 

 

 

 

behave as outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins.

 

 

 

 

 

 

 

 

 

 

OE is masked during the data portion of a Write sequence, during the first clock when emerging

 

 

 

 

 

 

 

 

 

 

from a deselected state, when the device has been deselected.

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Clock Enable Input, active LOW. When asserted LOW the Clock signal is recognized by the

 

 

CEN

 

 

 

 

 

 

 

 

 

Synchronous

SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not

 

 

 

 

 

 

 

 

 

 

deselect the device, CEN can be used to extend the previous cycle when required.

 

 

ZZ

Input-

ZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition

 

 

 

 

 

 

 

 

 

Asynchronous

with data integrity preserved. During normal operation, this pin can be connected to VSS or left

 

 

 

 

 

 

 

 

 

 

floating.

 

 

 

 

 

 

DQs

I/O-

Bidirectional Data I/O Lines. As inputs, they feed into an on-chip data register that is triggered

 

 

 

 

 

 

 

 

 

Synchronous

by the rising edge of CLK. As outputs, they deliver the data contained in the memory location

 

 

 

 

 

 

 

 

 

 

specified by address during the clock rise of the Read cycle. The direction of the pins is controlled

 

 

 

 

 

 

 

 

 

 

by OE and the internal control logic. When OE is asserted LOW, the pins can behave as outputs.

 

 

 

 

 

 

 

 

 

 

When HIGH, DQs are placed in a three-state condition. The outputs are automatically three-stated

 

 

 

 

 

 

 

 

 

 

during the data portion of a Write sequence, during the first clock when emerging from a deselected

 

 

 

 

 

 

 

 

 

 

state, and when the device is deselected, regardless of the state of OE.

 

 

 

 

 

 

Mode

Input

Mode Input. Selects the burst order of the device.

 

 

 

 

 

 

 

 

 

 

 

 

 

Strap Pin

When tied to Gnd selects linear burst sequence. When tied to VDD or left floating selects interleaved

 

 

 

 

 

 

 

 

 

 

burst sequence.

 

 

 

 

 

 

VDD

Power Supply

Power supply inputs to the core of the device.

 

 

 

 

 

 

VDDQ

I/O Power

Power supply for the I/O circuitry.

 

 

 

 

 

 

 

 

 

 

 

 

 

Supply

 

 

 

 

 

 

 

 

 

 

 

VSS

Ground

Ground for the device.

 

 

 

 

 

 

NC

No Connects. Not Internally connected to the die.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4M, 9M,18M,36M, 72M, 144M, 256M, 576M and 1G are address expansion pins and are not

 

 

 

 

 

 

 

 

 

 

internally connected to the die.

 

 

 

 

 

Document #: 001-00209 Rev. **

Page 3 of 12

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram Functional Description1CY7C1333H-133 CY7C1333H-100 Unit Pin ConfigurationsSelection Guide CY7C1333HName Description Mode Input. Selects the burst order of the devicePower supply inputs to the core of the device Power supply for the I/O circuitryFunctional Overview Parameter Description Test Conditions Min Max Unit Linear Burst Address Table Mode = GNDFirst Second Third Fourth Address A1, A0 First Second Third Fourth AddressFunction Truth Table for Read/Write 2Maximum Ratings Operating RangeThermal Resistance11 Switching Characteristics Over the Operating Range 12 CapacitanceAC Test Loads and Waveforms Read/Write Waveforms 18, 19 Switching WaveformsAddress Hold after CLK Rise AD Hold after CLK RiseZZ Mode Timing22 Ordering InformationNOP, Stall and Deselect Cycles18, 19 Lead Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm A101 Package DiagramIssue Date Orig. Description of Change 347377 New DatasheetDocument History