Cypress CY62158E manual Maximum Ratings, Operating Range, Electrical Characteristics, Capacitance

CY62158E MoBL→

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature	–65°C to +150°C
Ambient Temperature with
Power Applied	–55°C to +125°C

Supply Voltage to Ground Potential –0.5V to VCC(max) + 0.5V

DC Voltage Applied to Outputs
in High-Z State [3, 4]	–0.5V to V	+ 0.5V
	CC(max)

DC Input Voltage [3, 4]		–0.5V to V		+ 0.5V
		CC(max)
Output Current into Outputs (LOW)				20 mA
Static Discharge Voltage			>2001V
(MIL-STD-883, Method 3015)
Latch up Current			>200 mA
Operating Range
Device	Range	Ambient		[5]
		Temperature		VCC
CY62158ELL	Industrial	–40°C to +85°C	4.5V – 5.5V

Electrical Characteristics

Over the Operating Range

-45

Parameter

Description

Test Conditions

Min

Typ [2]

Max

Unit

VOH

Output HIGH Voltage

IOH = –1 mA

2.4

V

VOL

Output LOW Voltage

IOL = 2.1 mA

0.4

V

VIH

Input HIGH Voltage

VCC = 4.5V to 5.5V

2.2

VCC + 0.5V

V

VIIL

Input LOW Voltage

VCC = 4.5V to 5.5V

–0.5

0.8

V

IIX

Input Leakage Current

GND < VI < VCC

–1

+1

μA

IOZ

Output Leakage Current

GND < VO < VCC, Output Disabled

–1

+1

μA

ICC

VCC Operating Supply

f = fMAX = 1/tRC

VCC

= VCCmax

18

25

mA

Current

IOUT

= 0 mA

f = 1 MHz

1.8

3

mA

CMOS levels

ISB1

Automatic CE Power down

CE

1 > VCC− 0.2V, CE2

<

0.2V

2

8

μA

Current — CMOS Inputs

VIN > VCC – 0.2V, VIN < 0.2V)

f = fMAX

(Address and Data Only),

f = 0 (OE, and WE), VCC = VCCmax

ISB2 [6]

Automatic CE Power-down

CE

1 > VCC – 0.2V or CE2 < 0.2V,

2

8

μA

Current — CMOS Inputs

VIN > VCC – 0.2V or VIN < 0.2V,

f = 0, VCC = VCCmax

Capacitance

Tested initially and after any design or process changes that may affect these parameters.

Parameter	Description	Test Conditions	Max	Unit
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	10	pF
		VCC = VCC(typ)
COUT	Output Capacitance		10	pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter	Description	Test Conditions	TSOP II	Unit
ΘJA	Thermal Resistance	Still Air, soldered on a 3 × 4.5 inch,	75.13	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		8.95	°C/W
	(Junction to Case)

Notes

3.VIL(min) = –2.0V for pulse durations less than 20 ns.

4.VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.

5.Full Device AC operation assumes a 100 μs ramp time from 0 to VCC (min) and 200 μs wait time after VCC stabilization.

6.Only chip enables (CE1 and CE2), must be tied to CMOS levels to meet the ISB2 / ICCDR spec. Other inputs can be left floating.

Document #: 38-05684 Rev. *D Page 3 of 10

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