CY62158E MoBL→
Document History Page
Document Title: CY62158E MoBL→
Document Number:
REV. | ECN NO. | Issue Date | Orig. of |
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Change | Description of Change | ||||
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** | 270350 | See ECN | PCI | New Data Sheet | |
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*A | 291271 | See ECN | SYT | Converted from Advance Information to Preliminary | |
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| Changed input pulse level from VCC to 3V in the AC Test Loads and Waveforms | |
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| Modified footnote #9 to include timing reference level of 1.5V and input pulse | |
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| level of 3V | |
*B | 1462592 | See ECN | VKN/AESA | Converted from preliminary to final | |
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| Removed 35 ns speed bin | |
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| Removed “L” parts | |
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| Removed | |
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| Changed ICC(max) spec from 2.3 mA to 3 mA at f=1 MHz | |
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| Changed ICC(typ) spec from 16 mA to 18 mA at f=fMAX | |
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| Changed ICC(max) spec from 28 mA to 25 mA at f=fMAX | |
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| Changed ISB1(typ) and ISB2(typ) spec from 0.9 μA to 2 μA | |
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| Changed ISB1(max) and ISB2(max) spec from 4.5 μA to 8 μA | |
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| Changed ICCDR(max) spec from 4.5 μA to 8 μA | |
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| Changed tLZOE spec from 3 ns to 5 ns | |
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| Changed tLZCE spec from 6 ns to 10 ns | |
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| Changed tHZCE spec from 22 ns to 18 ns | |
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| Changed tPWE spec from 30 ns to 35 ns | |
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| Changed tSD spec from 22 ns to 25 ns | |
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| Changed tLZWE spec from 6 ns to 10 ns | |
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| Added footnote# 6 related to ISB2 and ICCDR | |
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| Updated Ordering information table | |
*C | 2428708 | See ECN | VKN/PYRS | Corrected typo in the Ordering Information table | |
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*D | 2516494 | See ECN | PYRS | Corrected ECN number | |
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© Cypress Semiconductor Corporation, 2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in
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Document #: | Revised June 16, 2008 | Page 10 of 10 |
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