Cypress CY62146DV30 Thermal Resistance9, AC Test Loads and Waveforms10, Data Retention Waveform

CY62146DV30

Capacitance (for all packages)[9]

Parameter			Description		Test Conditions	Max.			Unit
CIN		Input Capacitance			TA = 25°C, f = 1 MHz,	10			pF
					VCC = VCC(typ)
COUT		Output Capacitance				10			pF
Thermal Resistance[9]
Parameter	Description				Test Conditions		BGA	TSOP II		Unit
ΘJA	Thermal Resistance			Still Air, soldered on a 3 × 4.5 inch, four-layer			72	75.13		°C/W
	(Junction to Ambient)			printed circuit board
ΘJC	Thermal Resistance						8.86	8.95		°C/W
	(Junction to Case)

AC Test Loads and Waveforms[10]

R1

VCC

OUTPUT

50 pF

INCLUDING

JIG AND

SCOPE

VCC		ALL INPUT PULSES
					90%
10%		90%				10%
GND						Fall Time = 1 V/ns
R2 Rise Time = 1 V/ns
Equivalent to:			THÉVENIN EQUIVALENT
				RTH
	OUTPUT						V

Parameters	2.50V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description	Conditions		Min.		Typ.[5]	Max.	Unit
VDR	VCC for Data Retention			1.5				V
ICCDR	Data Retention Current	VCC= 1.5V	L				9	∝A
		CE > VCC – 0.2V,
			LL				6
		VIN > VCC – 0.2V or VIN < 0.2V
tCDR[9]	Chip Deselect to Data Retention Time				0			ns
t [11]	Operation Recovery Time			t	RC			ns
R

Data Retention Waveform

	VCC(min)	DATA RETENTION MODE	VCC(min)
VCC		VDR > 1.5 V
	tCDR		tR
CE

Notes:

9.Tested initially and after any design or process changes that may affect these parameters.

10. Test condition for the 45 ns part is a load capacitance of 30 pF.

11. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 ∝s or stable at VCC(min.) > 100 ∝s.

Document #: 38-05339 Rev. *A Page 4 of 11

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