Compaq EXS Series manual Removal & Replacement Preliminaries, Electrostatic Discharge Information

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chapter 3

REMOVAL & REPLACEMENT PRELIMINARIES

This chapter provides general service information for the computer. Adherence to the procedures and precautions described in this chapter is essential for proper service.

CAUTION: When the computer is plugged into an AC power source there is always voltage applied to the system board. You must disconnect the power cord from the power source before opening the computer to prevent system board or component damage.

3.1Electrostatic Discharge Information

A sudden discharge of static electricity from your finger or other conductor can destroy static-sensitive devices or microcircuitry. Often the spark is neither felt nor heard, but damage occurs. An electronic device exposed to electrostatic discharge (ESD) may not be affected at all and can work perfectly throughout a normal cycle. The device may function normally for a while, then degrade in the internal layers, reducing its life expectancy.

Networks built into many integrated circuits provide some protection, but in many cases, the discharge contains enough power to alter device parameters or melt silicon junctions.

3.1.1Generating Static

The following table shows that:

!Different activities generate different amounts of static electricity.

!Static electricity increases as humidity decreases.

 

Relative Humidity

 

Event

55%

40%

10%

Walking across carpet

7,500

V

15,000

V

35,000

V

Walking across vinyl floor

3,000

V

5,000

V

12,000

V

Motions of bench worker

400

V

800

V

6,000

V

Removing DIPs* from plastic tube

400

V

700

V

2,000

V

Removing DIPs* from vinyl tray

2,000

V

4,000

V

11,500

V

Removing DIPs* from Styrofoam

3,500

V

5,000

V

14,500

V

Removing bubble pack from PCB

7,000

V

20,000

V

26,500

V

Packing PCBs in foam-lined box

5,000

V

11,000

V

21,000

V

*Dual Inline Packaging (DIP) is the packaging around individual microcircuitry. These are then multi-packaged inside plastic tubes, trays, or Styrofoam.

700 volts can degrade a product.

Compaq Deskpro EX and Deskpro EXS Series of Personal Computers 3-1

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Contents Maintenance & Service Guide Maintenance & Service Guide Maintenance & Service Guide Contents Removal and Replacement Procedures Specifications About this Guide Symbols and ConventionsTechnician Notes Locating Additional Information Chapter Product DescriptionFront Panel Controls and LEDs Computer FeaturesComponent/Function Rear Panel Connectors ComponentReference Drive Bay Configuration Drive PositionsSerial Number Location Spare Parts Spare Part Warranty Description Number Tier System UnitMass Storage Devices Cables Standard, Memory, and Expansion Boards Miscellaneous Plastics Kit Keyboards not illustrated Miscellaneous Screw Kit not illustratedDocumentation and Software not illustrated Miscellaneous Parts not illustratedShipping Boxes not illustrated Description Spare Part NumberGenerating Static Removal & Replacement PreliminariesElectrostatic Discharge Information Relative Humidity Event 55% 40% 10%Grounding Workstations Preventing Electrostatic Damage to EquipmentPersonal Grounding Methods and Equipment Method VoltageRoutine Care General Cleaning Safety PrecautionsRecommended Materials and Equipment Cleaning the Keyboard Cleaning the Computer CaseCleaning the Monitor Power Supply Fan Service ConsiderationsCleaning the Mouse Tools and Software RequirementsLithium Coin Cell Battery Cables and ConnectorsHard Drives Removal and Replacement Procedures Disassembly Sequence ChartDisassembly Preparation Feet Installation Cable Lock Access Panel Front Bezel Power Button Subpanel and Bezel Blanks Power Switch Assembly Drive Positions Using the Cable-Select Feature with Ultra ATA Devices Removing an Internal 3.5-Inch Hard Drive Removing an External 5.25-Inch Drive Removing an External 3.5-Inch Drive Page Expansion Boards Expansion Board SlotsRemoving a PCI Expansion Board Installing a PCI Expansion Board Page System Memory Memory Module InstallationDIMMs Page Graphics Cards Installing a GPA/AIMM Card 24Removal & Replacement Procedures AGP Card with a Type I Retention Mechanism Removing an AGP Card13.3 GPA/AIMM Card with a Type 2 Retention Mechanism AGP Card with a Type 2 Retention Mechanism Standard AGP Expansion Card Processor 30Removal & Replacement Procedures System Board Battery Chassis Fan Assembly Power Supply Connectors and Jumpers Connectors and JumpersClearing Cmos Disabling or Clearing the Power-On and Setup Passwords Seagate, Quantum, and Western Digital Hard Drive Jumper SettingsDefinition Seagate Quantum Western Digital Maxtor Definition J50 J48 J46 J44 J42Specifications SpecificationsSystem Hardware IRQ System Function System InterruptsSystem DMA Hardware DMA System FunctionICH Fixed I/O Registers Port Register NameICH Fixed I/O Registers Port Register Name System Memory Map Size Memory Address System FunctionDrives MB Diskette DriveUltra ATA Hard Drives 10.0 GB 15.0 GBCD-ROM Drives 48X MaxCompaq Keyboard Scroll MouseIntel 3D Graphics Supported Graphics ResolutionsColor Depth Mode Bits/pixel Refresh Rate Hz NVIDIA M64 ProIndex 2Index