Compaq EX Series, EXS Series manual System Memory, DIMMs, Memory Module Installation

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4.12System Memory

The computer comes with synchronous dynamic random access memory (SDRAM) dual inline memory modules (DIMMs). The Intel 815 chipset comes with at least 64 MB of SDRAM DIMMS, upgradeable to 512 MB.

DIMMs

The memory sockets on the Intel 815 chipset–based system board can be populated with industry-standard DIMMs. These memory module slots are populated with at least one preinstalled memory module. To achieve the maximum memory support, you may be required to replace the preinstalled DIMM with a higher capacity DIMM.

For proper system operation, the DIMMs must be industry-standard 168-pin, unbuffered PC100– or PC133– compliant SDRAM DIMMs, depending on the model. The SDRAM DIMMs must support CAS Latency 2 or 3 (CL = 2 or CL = 3). They must also contain the mandatory Joint Electronic Device Engineering Council (JEDEC) Serial Presence Detect (SPD) information. DIMMs constructed with x4 SDRAM (16 ICs per side) are not supported; the system will not start using unsupported DIMMs.

The Intel 815 chipset supports both PC100 and PC133 SDRAM DIMMs. PC133 DIMMs should be used for optimal performance. If both PC100 and PC133 SDRAM DIMMs are installed in a computer, the system memory will run at the lower 100Mhz speed. Some configurations of PC133 SDRAMs may run at 100Mhz, instead of 133Mhz.

Memory Module Installation

CAUTION: Your memory module sockets have gold metal contacts. When upgrading your memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other.

CAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. Refer to Appendix F, “Electrostatic Discharge,” for more information.

CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module.

4-20Removal & Replacement Procedures

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Contents Maintenance & Service Guide Maintenance & Service Guide Maintenance & Service Guide Contents Removal and Replacement Procedures Specifications Technician Notes Symbols and ConventionsAbout this Guide Locating Additional Information Product Description ChapterComponent/Function Computer FeaturesFront Panel Controls and LEDs Component Rear Panel ConnectorsDrive Positions Reference Drive Bay ConfigurationSerial Number Location Spare Parts System Unit Spare Part Warranty Description Number TierMass Storage Devices Cables Standard, Memory, and Expansion Boards Miscellaneous Plastics Kit Miscellaneous Screw Kit not illustrated Keyboards not illustratedDescription Spare Part Number Miscellaneous Parts not illustratedShipping Boxes not illustrated Documentation and Software not illustratedRelative Humidity Event 55% 40% 10% Removal & Replacement PreliminariesElectrostatic Discharge Information Generating StaticMethod Voltage Preventing Electrostatic Damage to EquipmentPersonal Grounding Methods and Equipment Grounding WorkstationsRecommended Materials and Equipment General Cleaning Safety PrecautionsRoutine Care Cleaning the Monitor Cleaning the Computer CaseCleaning the Keyboard Tools and Software Requirements Service ConsiderationsCleaning the Mouse Power Supply FanHard Drives Cables and ConnectorsLithium Coin Cell Battery Disassembly Sequence Chart Removal and Replacement ProceduresDisassembly Preparation Feet Installation Cable Lock Access Panel Front Bezel Power Button Subpanel and Bezel Blanks Power Switch Assembly Drive Positions Using the Cable-Select Feature with Ultra ATA Devices Removing an Internal 3.5-Inch Hard Drive Removing an External 5.25-Inch Drive Removing an External 3.5-Inch Drive Page Expansion Board Slots Expansion BoardsRemoving a PCI Expansion Board Installing a PCI Expansion Board Page DIMMs Memory Module InstallationSystem Memory Page Graphics Cards Installing a GPA/AIMM Card 24Removal & Replacement Procedures Removing an AGP Card AGP Card with a Type I Retention Mechanism13.3 GPA/AIMM Card with a Type 2 Retention Mechanism AGP Card with a Type 2 Retention Mechanism Standard AGP Expansion Card Processor 30Removal & Replacement Procedures System Board Battery Chassis Fan Assembly Power Supply Connectors and Jumpers Connectors and JumpersClearing Cmos Disabling or Clearing the Power-On and Setup Passwords Definition Seagate Quantum Western Digital Hard Drive Jumper SettingsSeagate, Quantum, and Western Digital Definition J50 J48 J46 J44 J42 MaxtorSystem SpecificationsSpecifications Hardware DMA System Function System InterruptsSystem DMA Hardware IRQ System FunctionPort Register Name ICH Fixed I/O RegistersICH Fixed I/O Registers Port Register Name Size Memory Address System Function System Memory MapMB Diskette Drive Drives10.0 GB 15.0 GB Ultra ATA Hard Drives48X Max CD-ROM DrivesScroll Mouse Compaq KeyboardNVIDIA M64 Pro Supported Graphics ResolutionsColor Depth Mode Bits/pixel Refresh Rate Hz Intel 3D GraphicsIndex 2Index