Samsung SCLSeries manual 260 Max, Recommended soldering pattern dimensionsmm

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Table 4 Recommended soldering pattern dimensions(mm)

Dimensions

Capacitors

size

 

Pattern

dimensions

 

Case

L

W

x

 

y

z

J

1.6

0.85

0.9

 

1.0

0.7

P

2.0

1.25

1.2

 

1.1

0.8

S

3.2

1.6

1.6

 

1.2

1.2

T

3.5

2.8

1.6

 

2.2

1.4

U

5.8

3.2

2.3

 

2.4

2.4

V

7.3

4.3

2.3

 

2.6

3.8

Chip Soldering Temperature and Time

Capacitors are capable of withstanding the following soldering temperatures and conditions;

Waved soldering

Capacitor body temperature : 230260

Time : 5 seconds or less

Reflow soldering see figures

Temp.

Heating

260Max

200

Cooling

Pre-heating

 

100

100

200

300

400

Time(sec)

SCL Series

Figure : Typical Temperature Profile of Reflow Soldering (pb-free)

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Contents Tantalum Capacitor SCL Series Capacitance Abbriviation of Tantalum Capacitor Type of SeriesRated Voltage Capacitance TolerancePacking Polarity Symbol Packing Code InchPacking Taping100 150Reliability Test Condition Items Test Condition Performance +85Pressure BoardChip Scratch toolR0.5 Pressure R0.5Solder Alumina Board Series 35V MarkingCap Capacitance RangeSmall Letter Capital Letter SmallEmbossed Plastic Tape Cover Tape 15˚ Removal speed 50mm/secTape Min ±0.5 ±051 +0.5 Width ±0.079 ±0.020 Reel DimensionCase Size 180mm7 reel 330mm13 reel Reference Operating Voltage Power Supply Circuit100 125 Ripple Current TemperatureRipple AmbientCorrection CoefficientK Table.2 Hz VS K Frequency 120 400 10k 20k 40k 100k 10K 100KRipple Voltage Reverse Voltage FrequencyHzFailure Rate Calculation Formula Reliability of Tantalum Capacitors▷ Failure rate calculation formula Reliability Prediction Reliability NomographRecommended Soldering Pattern Dimensions Mounting PrecautionsLimit Pressure on Capacitor Installation with Mounter FluxRecommended soldering pattern dimensionsmm 260 MaxCleaning after Mounting Other