Dram ECC Enable, Bit ECC Mode | SUPER MICRO Computer H8DII+-F

H8DI3+/I+(-F) Serverboard User’s Manual

DRAM ECC Enable

This setting allows hardware to report and correct memory errors automatically, maintaining system integrity. Options are Enabled or Disabled.

DRAM Scrub Redirect

This setting allows the system to correct DRAM ECC errors immedi- ately when they occur, even if background scrubbing is off. Options are Enabled or Disabled.

4-Bit ECC Mode

This setting enables 4-Bit ECC mode (also known as CHIPKILL ECC Mode). Options are Enabled or Disabled.

DRAM BG Scrub

DRAM scrubbing corrects memory errors so later reads are correct. Doing this while memory is not being used improves performance. Options are Disabled and time increments from 40ns to 655.4us with 163.8us the default.

Note: When AMD's Node Interleave feature is enabled, the BIOS will force DRAM scrub off.

DATA Cache BG Scrub

This setting allows L1 data cache RAM to be corrected while idle. Options are Disabled and time increments from 40ns to 655.4us with 2.5us the default.

L2 Cache BG Scrub

This setting allows L2 data cache RAM to be corrected while idle. Options are Disabled and time increments from 40ns to 655.4us with 2.5us the default.

L3 Cache BG Scrub

This setting allows L3 data cache RAM to be corrected while idle. Options are Disabled and time increments from 40ns to 655.4us with 2.5us the default.

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H8DII+, H8DI3+, H8DII+-F, H8DI3+-F specifications

Super Micro Computer, a leader in high-performance server solutions, offers a range of motherboards designed for demanding enterprise applications. Notable models include the H8DI3+-F, H8DII+-F, H8DI3+, and H8DII+. These motherboards incorporate advanced technologies tailored for reliability, flexibility, and scalability, making them ideal for data centers, virtualization, and high-performance computing tasks.

The H8DI3+-F and H8DII+-F motherboards are optimized for dual AMD Opteron processors, delivering exceptional processing power with support for both single and dual-socket configurations. This flexibility allows users to tailor their systems according to specific application needs, whether they require a compact setup or a more extensive, scalable infrastructure.

Key features include support for DDR4 memory, which enhances bandwidth and energy efficiency. The H8DI3+-F and H8DII+-F motherboards support up to 1TB of RAM through 16 DIMM slots, enabling the hosting of memory-intensive applications with ease. This is complemented by advanced error-correcting code (ECC) memory support, ensuring data integrity and stability in mission-critical environments.

Both motherboards include several PCIe slots, facilitating the integration of high-performance GPUs and storage solutions. This modularity is crucial for businesses looking to harness the power of GPU computing for tasks such as artificial intelligence, machine learning, and data analytics.

Storage options are robust, with support for multiple 2.5” or 3.5” drives and RAID configurations, allowing for rapid data access and redundancy. These features ensure that organizations can maintain high availability and minimize downtime.

Additionally, the H8DI3+ and H8DII+ models boast integrated dual 10Gb/s Ethernet ports for high-speed network connectivity, essential for optimizing data transfers and ensuring seamless communication across distributed systems.

In terms of reliability, Super Micro emphasizes military-grade components and extensive testing, providing peace of mind to users in critical environments. Each model supports comprehensive management features, including remote access capabilities and thermal monitoring, contributing to reduced operational costs.

Overall, Super Micro's H8DI3+-F, H8DII+-F, H8DI3+, and H8DII+ motherboards represent the pinnacle of server technology, combining robust performance, extensive scalability, and innovative features designed to address the evolving demands of modern enterprise computing. These motherboards are ideal for organizations seeking powerful, flexible systems that can adapt to future technological advancements.