Sony 4-216-840-0 Precautions for Checking Laser Diode Emission, Precautions for Adjustments

Page 22

2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION

To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.

3. PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260A)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before con- necting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

flexible board

 

laser tap

Optical pick-up flexible board

4. PRECAUTIONS FOR ADJUSTMENTS

1.When replacing the following parts, perform the adjustments and checks with Âin the order shown in the following table.

 

Optical

 

 

BD Board

 

 

Pick-up

IC171

D101

 

IC101, IC121

IC192

 

 

 

 

 

 

 

1. Initial setting of

Â

Â

G

 

Â

G

adjustment value

 

 

 

 

 

 

 

 

2. Recording of IOP

 

 

 

 

 

 

information

Â

Â

G

 

G

G

(Value written in

 

the pick-up)

 

 

 

 

 

 

 

 

 

 

 

 

 

3. Temperature

 

 

 

 

 

 

compensation

G

Â

Â

 

G

G

offset adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

4. Laser power

Â

Â

G

 

Â

Â

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5. Traverse

Â

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6. Focus bias

Â

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7. Error rate check

Â

Â

G

 

Â

G

 

 

 

 

 

 

 

8. Auto gain output

Â

Â

G

 

Â

G

level adjustment

 

 

 

 

 

 

2.Set the test mode when performing adjustments. After completing the adjustments, exit the test mode. Perform the adjustments and checks in “group S” of the test mode.

3.Perform the adjustments to be needed in the order shown.

4.Use the following tools and measuring devices.

• Check Disc (MD) TDYS-1

(Parts No. 4-963-646-01)

TEST DISK (MDW-74/AU-1) (Parts No. 8-892-341-41)

Laser power meter LPM-8001 (Parts No. J-2501-046-A) or MD Laser power meter 8010S (Parts No. J-2501-145-A)

Oscilloscope (Measure after performing CAL of prove)

Digital voltmeter

Thermometer

Jig for checking BD board waveform

(Parts No. : J-2501-149-A)

5.When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscil- loscope.

(VC and ground will become short-circuited)

6.Using the above jig enables the waveform to be checked with- out the need to solder.

(Refer to Servicing Notes on page 6)

7.As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Laser power meter

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (J-2501- 145-A) instead of the conventional laser power meter is conve- nient.

It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of the pick-up.

5.CREATING CONTINUOUSLY-RECORDED DISC

* This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc.

1.Insert a disc (blank disc) commercially available.

2.Turn the =AMS + knob and display “CREC MODE”. (C31)

3.Press the [YES] button again to display “CREC MID”. Display “CREC (0300)” and start to recording.

4.Complete recording within 5 minutes.

5.Press the [MENU/NO] button and stop recording .

6.Press the [ÊÊÊÊÊEJECT]¤ button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note :

• Be careful not to apply vibration during continuous-recording.

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Contents MDS-JE520 SpecificationsMDM-5A SELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Diagrams Table of ContentsSection Servicing Notes Flexible Circuit Board Repairing VarningJIG for Checking BD Board Waveform IOPRecord Precedure Checks Prior to Parts Replacement and Adjustments Criteria for Determination Measure if unsatisfactoryRetry Cause Display Mode PrecedureHexadecimal nBinary Conversion Table Section General Cover Section DisassemblyFront Panel Section Main Board Mechanism Deck Section MDM-5ASlider CAM Base Unit MBU-5A, BD BoardSW BOARD, Loading Motor M103 Setting the Test Mode Section Test ModePrecautions for USE of Test Mode Exiting the Test ModeSelecting the Test Mode Display Contents Mark GroupMID Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode OUTTest Mode Displays Functions of Other ButtonsMeanings of Other Displays Section Electrical Adjustments Parts Replacement and AdjustmentPrecautions for Adjustments Precautions for Checking Laser Diode EmissionPrecautions for USE of Optical PICK-UP KMS-260A Laser power meterCheck Prior to Repairs Temperature Compensation Offset CheckLaser Power Check Traverse CheckFocus Bias Check Play Checking MO Error Rate CheckCD Error Rate Check Self-Recording/playback CheckLaser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjustment Recording and Displaying the IOP InformationTraverse Adjustment Focus Bias Adjustment ING CONTINUOUSLY-RECORDED DiscCD Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjustment Location Section Diagrams IC PIN Function DescriptionSrdt MNT2 XbusyXlat SensAsyo XrasXWE AsyiSfdr FS4Srdr SprdCnvss AderByte RSTLdin STBChack LD-LOWPlay Analog OUT Block Diagram MD Servo Section∙ Signal Path REC Analog REC DigitalBlock Diagram Main Section REC AnalogCircuit Boards Location CNDSemiconductor Location MDS-M100 Schematic Diagram BD Board 2/2 See 65 for Waveforms. See page 51 for IC Block DiagramSchematic Diagram SW Board Printed Wiring Board SW BoardIC406 M62016L IC421 M5293L IC121 CXD2654RMain Board IC301 ΜDA1341TS/N2 IC152 BH6511FS-E2MDS-M100 Semiconductor Location Schematic Diagram Main Board 1/2 See page 65 for Waveform MDS-M100 Ref. No Location D741 D742 IC761 Q741 Q742 Q767 MDS-M100 Exploded Views SectionCover Section Chassis Section AEP, SP209 4-988-466-11 Spring ELECTROSTATIC, Leaf Mechanism Section MDM-5A201 206 204 205 221 A-4680-409-A Holder Complete AssyBase Unit Section MBU-5A Section Electrical Parts List AC Select BDCXA2523AR Short SwitchIC/TRANSISTOR Transistor FMW1Main ConnectorCeramic Carbon InductorExcept US, CND Main Panel Panel SW Trans Sony Corporation