Sony 4-216-840-0 service manual Circuit Boards Location, Cnd

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• Circuit Boards Location

6-4. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

TRANS board

BD board

PANEL 2 board

PANEL board

AC SELECT board (Singapore)

MAIN board

SW board

Note on Printed Wiring Board:

•X : parts extracted from the component side.

•Y : parts extracted from the conductor side.

•p : parts mounted on the conductor side.

•¨ : Through hole.

•b: Pattern from the side which enables seeing.

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Side B)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Side A)	the parts face are indicated.

•Indication of transistor.

Q

B C E

These are omitted.

• Abbreviation

CND	: Canadian model
SP	: Singapore model

Note on Schematic Diagram:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•¢ : internal component.

•C : panel designation.

Note:	Note:
The components identi-	Les composants identifiés par
fied by mark !or dotted	une marque !sont critiques
line with mark !are criti-	pour la sécurité.
cal for safety.	Ne les remplacer que par une
Replace only with part	piéce portant le numéro
number specified.	spécifié.

•U : B+ Line.

•V : B– Line.

•Voltages and waveforms are dc with respect to ground in playback mode.

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PLAY (ANALOG OUT)

j : REC (ANALOG IN)

l : REC (DIGITAL IN)

•Abbreviation

CND	: Canadian model
SP	: Singapore model

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Contents MDM-5A SpecificationsMDS-JE520 SELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Section Servicing Notes Table of ContentsDiagrams Flexible Circuit Board Repairing VarningJIG for Checking BD Board Waveform IOPRecord Precedure Checks Prior to Parts Replacement and Adjustments Criteria for Determination Measure if unsatisfactoryRetry Cause Display Mode PrecedureHexadecimal nBinary Conversion Table Section General Front Panel Section Section DisassemblyCover Main Board Mechanism Deck Section MDM-5ASlider CAM Base Unit MBU-5A, BD BoardSW BOARD, Loading Motor M103 Setting the Test Mode Section Test ModePrecautions for USE of Test Mode Exiting the Test ModeSelecting the Test Mode Display Contents Mark GroupMID Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode OUTTest Mode Displays Functions of Other ButtonsMeanings of Other Displays Section Electrical Adjustments Parts Replacement and AdjustmentPrecautions for Adjustments Precautions for Checking Laser Diode EmissionPrecautions for USE of Optical PICK-UP KMS-260A Laser power meterCheck Prior to Repairs Temperature Compensation Offset CheckLaser Power Check Traverse CheckFocus Bias Check Play Checking MO Error Rate CheckCD Error Rate Check Self-Recording/playback CheckLaser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjustment Recording and Displaying the IOP InformationTraverse Adjustment Focus Bias Adjustment ING CONTINUOUSLY-RECORDED DiscCD Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjustment Location Section Diagrams IC PIN Function DescriptionSrdt MNT2 XbusyXlat SensAsyo XrasXWE AsyiSfdr FS4Srdr SprdCnvss AderByte RSTLdin STBChack LD-LOWPlay Analog OUT Block Diagram MD Servo Section∙ Signal Path REC Analog REC DigitalBlock Diagram Main Section REC AnalogCircuit Boards Location CNDSemiconductor Location MDS-M100 Schematic Diagram BD Board 2/2 See 65 for Waveforms. See page 51 for IC Block DiagramSchematic Diagram SW Board Printed Wiring Board SW BoardIC406 M62016L IC421 M5293L IC121 CXD2654RMain Board IC301 ΜDA1341TS/N2 IC152 BH6511FS-E2MDS-M100 Semiconductor Location Schematic Diagram Main Board 1/2 See page 65 for Waveform MDS-M100 Ref. No Location D741 D742 IC761 Q741 Q742 Q767 MDS-M100 Cover Section SectionExploded Views Chassis Section AEP, SP209 4-988-466-11 Spring ELECTROSTATIC, Leaf Mechanism Section MDM-5A201 206 204 205 221 A-4680-409-A Holder Complete AssyBase Unit Section MBU-5A Section Electrical Parts List AC Select BDCXA2523AR Short SwitchIC/TRANSISTOR Transistor FMW1Ceramic ConnectorMain Except US, CND InductorCarbon Main Panel Panel SW Trans Sony Corporation