Sony 4-216-840-0 service manual Varning, Flexible Circuit Board Repairing

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CAUTION

Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer.

Discard used batteries according to the manufacturer’s instructions.

ADVARSEL!

Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.

Udskiftning må kun ske med batteri af samme fabrikat og type.

Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Eksplosjonsfare ved feilaktig skifte av batteri.

Benytt samme batteritype eller en tilsvarende type

anbefalt av apparatfabrikanten.

Brukte batterier kasseres i henhold til fabrikantens

instruksjoner.

VARNING

Explosionsfara vid felaktigt batteribyte.

Använd samma batterityp eller en likvärdig typ som rekommenderas av apparattillverkaren.

Kassera använt batteri enligt gällande föreskrifter.

VAROITUS

Paristo voi räjähtää, jos se on virheellisesti asennettu.

Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS

AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.

Laser component in this product is capable of emitting radia- tion exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !

SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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Contents MDM-5A SpecificationsMDS-JE520 SELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Section Servicing Notes Table of ContentsDiagrams Varning Flexible Circuit Board RepairingIOP JIG for Checking BD Board WaveformRecord Precedure Criteria for Determination Measure if unsatisfactory Checks Prior to Parts Replacement and AdjustmentsPrecedure Retry Cause Display ModeHexadecimal nBinary Conversion Table Section General Front Panel Section Section DisassemblyCover Mechanism Deck Section MDM-5A Main BoardBase Unit MBU-5A, BD Board Slider CAMSW BOARD, Loading Motor M103 Precautions for USE of Test Mode Section Test ModeSetting the Test Mode Exiting the Test ModeDisplay Contents Mark Group Selecting the Test ModeNon-Volatile Memory Mode EEP Mode Operating the Continuous Playback ModeMID OUTFunctions of Other Buttons Test Mode DisplaysMeanings of Other Displays Parts Replacement and Adjustment Section Electrical AdjustmentsPrecautions for USE of Optical PICK-UP KMS-260A Precautions for Checking Laser Diode EmissionPrecautions for Adjustments Laser power meterLaser Power Check Temperature Compensation Offset CheckCheck Prior to Repairs Traverse CheckCD Error Rate Check Play Checking MO Error Rate CheckFocus Bias Check Self-Recording/playback CheckTemperature Compensation Offset Adjustment Initial Setting of Adjustment ValueLaser Power Adjustment Recording and Displaying the IOP InformationTraverse Adjustment ING CONTINUOUSLY-RECORDED Disc Focus Bias AdjustmentAuto Gain Control Output Level Adjustment Error Rate CheckCD Auto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjustment Location IC PIN Function Description Section DiagramsXlat MNT2 XbusySrdt SensXWE XrasAsyo AsyiSrdr FS4Sfdr SprdByte AderCnvss RSTChack STBLdin LD-LOW∙ Signal Path Block Diagram MD Servo SectionPlay Analog OUT REC Analog REC DigitalREC Analog Block Diagram Main SectionCND Circuit Boards LocationSemiconductor Location MDS-M100 65 for Waveforms. See page 51 for IC Block Diagram Schematic Diagram BD Board 2/2 SeePrinted Wiring Board SW Board Schematic Diagram SW BoardMain Board IC301 ΜDA1341TS/N2 IC121 CXD2654RIC406 M62016L IC421 M5293L IC152 BH6511FS-E2MDS-M100 Semiconductor Location Schematic Diagram Main Board 1/2 See page 65 for Waveform MDS-M100 Ref. No Location D741 D742 IC761 Q741 Q742 Q767 MDS-M100 Cover Section SectionExploded Views AEP, SP Chassis Section201 206 204 205 Mechanism Section MDM-5A209 4-988-466-11 Spring ELECTROSTATIC, Leaf 221 A-4680-409-A Holder Complete AssyBase Unit Section MBU-5A AC Select BD Section Electrical Parts ListIC/TRANSISTOR Short SwitchCXA2523AR Transistor FMW1Ceramic ConnectorMain Except US, CND InductorCarbon Main Panel Panel SW Trans Sony Corporation
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